MP2152D – 2.5V TO 5.5V, 2A, LOW IQ, SYNC, STEP-DOWN CONVERTER
PIN FUNCTIONS
Name
(SOT563
Pin #
Description
and
UTQFN-6)
1
2
GND
Power ground.
Output switching node. The SW pin is the drain of the internal, P-Channel high-side
MOSFET (HS-FET). Connect SW to the inductor to complete the converter.
SW
Supply voltage. The MP2152D operates from a 2.5V to 5.5V unregulated input voltage
(VIN). Use a decoupling capacitor to prevent large voltage spikes at the input.
On/off control.
Feedback. To set the output voltage (VOUT), connect an external resistor divider tapped to
the FB pin between the output and GND.
3
4
5
VIN
EN
FB
Output sense. The OUT pin is the voltage power rail and input sense for VOUT. Use an
output capacitor (C2) to reduce the output voltage ripple (∆VOUT).
6
OUT
(1)
Thermal Resistance
SOT563
θJA
θJC
ABSOLUTE MAXIMUM RATINGS
Supply voltage (VIN) .................................... 6.5V
VSW................................-0.3V (-5V for <10ns) to
+6.5V (10V for <10ns)
All other pins................................-0.3V to +6.5V
Junction temperature ................................150°C
Lead temperature .....................................260°C
Continuous power dissipation (TA = 25°C)
SOT563 ..............................................1.5W (2) (4)
QFN .......................................................2W (2) (5)
Storage temperature................ -65°C to +150°C
EVL2152D-TF-00A (4).………..80…….50…°C/W
JESD51-7 (6) (7) (8) …………….130…....60…°C/W
UTQFN-6 (1.2mmx1.6mm)
EVL2152D-QFU-00A (5)………65…….30…°C/W
JESD51-7 (6) (7) (8)……………..173......127…°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX) - TA) / θJA. Exceeding the maximum allowable power
dissipation can produce an excessive die temperature, which
may cause the regulator to go into thermal shutdown. Internal
thermal shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its operating
conditions.
4) Measured on EVL2152D-TF-00A, 2-layer PCB.
5) Measured on EVL2152D-QFU-00A, 2-layer PCB.
6) Measured on JESD51-7, 4-layer PCB.
ESD Rating
SOT563
Human body model (HBM) ...................... 2000V
Charged device model (CDM)..................1500V
UTQFN-6 (1.2mmx1.6mm)
Human body model (HBM) ...................... 2000V
Charged device model (CDM)..................1500V
Recommended Operating Conditions (3)
7) The value of θJA given in this table is only valid for comparison
with other packages and cannot be used for design purposes.
8) These values are calculated in accordance with JESD51-7,
and simulated on a specified JEDEC board. They do not
represent the performance obtained in an actual application.
Supply voltage (VIN) ........................2.5V to 5.5V
Operating junction temp (TJ)…..-40°C to +125°C
MP2152D Rev. 1.0
11/18/2021
MonolithicPower.com
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2021 MPS. All Rights Reserved.
3