Datasheet > MMZ1608A222B

MMZ1608A222B

更新时间： 2024-11-09 05:49:31

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
8页	218K
描述
Chip Beads(SMD) For Signal Line

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中文翻译

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数据手册

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MMZ1608A222B 数据手册

(1/8)

Conformity to RoHS Directive

Chip Beads(SMD)

For Signal Line

MMZ Series MMZ1608 Type

FEATURES

SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD

• Chip bead(impeder), MMZ series offers 7 construction materials.

• Size standardized for use by automatic assembly equipment.

No preferred orientation.

PATTERN

1.6 0.15

• Either flow or reflow soldering methods can be used due to

electroplating of the terminal electrodes.

0.6

0.8

0.6

0.3 0.2

• High reliability due to an entirely monolithic structure.

• Closed magnetic circuit structure allows high-density installation

while preventing crosstalk between circuits.

• Low DC resistance structure of electrode prevents wasteful

electric power consumption.

( )

Thickness T Weight

0.6 0.15mm

0.8 0.15mm

3mg

4mg

Dimensions in mm

• The products contain no lead and also support lead-free

soldering.

TEMPERATURE RANGES

Operating/storage –55 to +125°C

• It is a product conforming to RoHS directive.

PACKAGING STYLE AND QUANTITIES

Packaging style

Quantity

APPLICATIONS

Taping

4000 pieces/reel

Removal of signal line noises of cellular phones, PCs, note PCs,

TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game

machines, digital photo frames, car navigation system, PNDs, etc.

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

PRODUCT IDENTIFICATION

10s max.

MMZ 1608

121

250 to 260˚C

230˚C

(1) (2) (3) (4) (5) (6)

Natural

cooling

(1) Series name

(2) Dimensions L×W

(3) Material code

(4) Nominal impedance

121:120Ω at 100MHz

(5) Characteristic type

(6) Packaging style

T:Taping

180˚C

150˚C

Preheating

60 to 120s

Soldering

30 to 60s

Time(s)

HANDLING AND PRECAUTIONS

• Before soldering, be sure to preheat components. The preheat-

ing temperature should be set so that the temperature difference

between the solder temperature and product temperature does

not exceed 150°C.

• After mounting components onto the printed circuit board, do not

apply stress through board bending or mishandling.

• Do not expose the inductors to stray magnetic fields.

• Avoid static electricity discharge during handling.

• When hand soldering, apply the soldering iron to the printed cir-

cuit board only. Temperature of the iron tip should not exceed

350°C. Soldering time should not exceed 3 seconds.

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• Please contact our Sales office when your application are considered the following:

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

• All specifications are subject to change without notice.

012-01 / 20100324 / e9412_mmz1608.fm

12 3 4 5 6 7 8

中文翻译

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与MMZ1608A222B相关器件

型号	品牌	获取价格	描述	数据表
MMZ1608A222BTA00	TDK	获取价格	FERRITE BEAD 2.2 KOHM 0603 1LN
MMZ1608A222BTD25	TDK	获取价格	FERRITE BEAD 2.2 KOHM 0603 1LN
MMZ1608A252B	TDK	获取价格	Chip Beads(SMD) For Signal Line
MMZ1608A252BT	TDK	获取价格	暂无描述
MMZ1608A252BTA00	TDK	获取价格	FERRITE BEAD 2.5 KOHM 0603 1LN
MMZ1608A252BTD25	TDK	获取价格	Ferrite Chip, 1 Function(s), 0.2A, HALOGEN FREE AND ROHS COMPLIANT, EIA STD PACKAGE SIZE 0
MMZ1608B102C	TDK	获取价格	Chip Beads(SMD) For Signal Line
MMZ1608B102CT	TDK	获取价格	Ferrite Chip, 1 Function(s), 0.3A, HALOGEN FREE AND ROHS COMPLIANT, EIA STD PACKAGE SIZE 0
MMZ1608B102CTA00	TDK	获取价格	Ferrite Chip,
MMZ1608B102CTD25	TDK	获取价格	Ferrite Chip, 1 Function(s), 0.3A, HALOGEN FREE AND ROHS COMPLIANT, EIA STD PACKAGE SIZE 0

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