MMSZ52xxET1 Series,
SZMMSZ52xxET1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
1
2
Features
Cathode
Anode
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 2.4 V to 110 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• General Purpose, Medium Current
SOD−123
CASE 425
STYLE 1
2
1
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 x 20 ms)
• AEC−Q101 Qualified and PPAP Capable
MARKING DIAGRAM
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
xxx M G
1
G
• Pb−Free Packages are Available
Mechanical Characteristics:
xxx = Device Code (Refer to page 2)
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
M
G
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
†
Device
Package
Shipping
MMSZ52xxET1
SOD−123
3000 / Tape &
Reel
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
MMSZ52xxET1G
SOD−123
(Pb−Free)
3000 / Tape &
Reel
Peak Power Dissipation @ 20 ms (Note 1)
P
pk
225
W
@ T ≤ 25°C
L
Total Power Dissipation on FR−5 Board,
P
D
SZMMSZ52xxET1G SOD−123
(Pb−Free)
3000 / Tape &
Reel
500
6.7
mW
mW/°C
(Note 3) @ T = 75°C
L
Derated above 75°C
MMSZ52xxET3
SOD−123
10000 / Tape &
Reel
Thermal Resistance, (Note 2)
Junction−to−Ambient
R
340
150
°C/W
°C/W
°C
q
JA
Thermal Resistance, (Note 2)
Junction−to−Lead
R
q
JL
MMSZ52xxET3G
SOD−123
(Pb−Free)
10000 / Tape &
Reel
Junction and Storage Temperature Range
T , T
J
−55 to
+150
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 11.
2. Thermal Resistance measurement obtained via infrared Scan Method.
3. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
November, 2011 − Rev. 7
MMSZ5221ET1/D