MMSZ5221B - MMSZ5259B
500mW SURFACE MOUNT ZENER DIODE
Lead-free
SPICE MODELS: MMSZ5221B MMSZ5223B MMSZ5225B MMSZ5226B MMSZ5227B MMSZ5228B MMSZ5229B MMSZ5230B MMSZ5231B MMSZ5232B
MMSZ5233B MMSZ5234B MMSZ5235B MMSZ5236B MMSZ5237B MMSZ5238B MMSZ5239B MMSZ5240B MMSZ5241B MMSZ5242B MMSZ5243B
MMSZ5245B MMSZ5246B MMSZ5248B MMSZ5250B MMSZ5251B MMSZ5252B MMSZ5254B MMSZ5255B MMSZ5256B MMSZ5257B MMSZ5258B MMSZ5259B
Features
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·
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·
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500mW Power Dissipation
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
Lead Free/RoHS Compliant (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
SOD-123
Min
Dim
A
Max
3.85
2.85
1.70
1.35
0.65
3.55
2.55
1.40
—
B
D
Mechanical Data
·
J
H
C
G
Case: SOD-123
D
·
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
0.45
A
B
E
0.55 Typical
0.25
0.11 Typical
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·
·
Moisture Sensitivity: Level 1 per J-STD-020C
E
C
G
H
J
—
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe)
—
0.10
·
·
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Polarity: Cathode Band
a
0°
8°
Ordering Information: See Page 2
Marking: See Below
All Dimensions in mm
Weight: 0.01 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
VF
Value
0.9
Unit
V
Forward Voltage
@ IF = 10mA
(Note 1)
Pd
Power Dissipation
500
mW
°C/W
°C
RqJA
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
350
Tj, TSTG
-65 to +150
2
Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm .
2. No purposefully added lead.
Marking Information
XX = Product Type Marking Code (See Page 2)
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
XX
Date Code Key
Year
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
Code
J
K
L
M
N
P
R
S
T
U
V
W
Month
Code
Jan
Feb
March
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
1
2
3
4
5
6
7
8
9
O
N
D
DS18010 Rev. 18 - 2
1 of 4
MMSZ5221B - MMSZ5259B
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ã Diodes Incorporated