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MMSZ5239C

更新时间： 2024-11-13 14:53:23

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MMSZ5239C 数据手册

JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD

SOD-123 Plastic-Encapsulate Diodes

SOD-123

MMSZ5221C-MMSZ5259C ^{ZENER DIODE}

FEATURES

• Planar Die Construction

• Ultra-Small Surface Mount Package

• General purpose, Medium Current

• Ideally Suited for Automated Assembly Processes

Maximum Ratings (T^a=25℃ unless otherwise specified)

Characteristic

Forward Voltage (Note 2)

Power Dissipation(Note 1)

Symbol

Value

0.9

Unit

@ I_F= 10mA

V_F

P_d

500

250

Thermal Resistance Junction to Ambient Air

RR^θJA

T_J,Tstg

℃/W

℃

Operation Junction and Storage Temperature Range

-55~+150

Notes:1. Mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with Ta=25 ℃.

2. Tested with pulses, Tp≤1.0ms.

www.jscj-elec.com

Rev. - 2.1

12 3 4 5

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