Datasheet > MMSZ5221B_09

MMSZ5221B_09

更新时间： 2024-11-05 10:51:39

品牌	Logo	应用领域
美台 - DIODES		稳压二极管
页数	文件大小	规格书
5页	87K
描述
500mW SURFACE MOUNT ZENER DIODE

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中文翻译

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MMSZ5221B_09 数据手册

MMSZ5221B - MMSZ5259B

500mW SURFACE MOUNT ZENER DIODE

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Features

Mechanical Data

•

500mW Power Dissipation

General Purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Lead, Halogen and Antimony Free, RoHS Compliant (Note 3)

"Green" Device (Note 4)

•

Case: SOD-123

Case Material: Molded Plastic, “Green” Molding Compound.

UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

•

Qualified to AEC-Q101 Standards for High Reliability

•

Polarity: Cathode Band

Ordering Information: See Page 3

Marking Information: See Page 3

Weight: 0.01 grams (approximate)

Top View

Maximum Ratings @T_A= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

0.9

Forward Voltage

@ I_F= 10mA

V_F

Thermal Characteristics

Characteristic

Power Dissipation (Note 1) @T_L= 75°C

Symbol

P_D

Value

500

Unit

Thermal Resistance, Junction to Ambient Air (Note 1)

Thermal Resistance, Junction to Lead (Note 2)

Operating and Storage Temperature Range

350

°C/W

°C

R_θ

T_J,T_STG

150

-65 to +150

Notes:

1. Device mounted on FR-4 substrate, single-sided, PC boards, with minimum recommended pad layout.

2. Thermal Resistance measurement obtained via infrared scan method.

3. No purposefully added lead. Halogen and Antimony Free.

4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃Fire Retardants.

1 of 5

www.diodes.com

May 2009

MMSZ5221B - MMSZ5259B

Document number: DS18010 Rev. 23 - 2

12 3 4 5

中文翻译

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