MMSZ4678ET1 Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
Features
• Pb−Free Packages are Available
• 500 mW Rating on FR−4 or FR−5 Board
1
2
Cathode
Anode
• Wide Zener Reverse Voltage Range − 1.8 V to 43 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 x 20 ms)
SOD−123
CASE 425
STYLE 1
2
1
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MARKING DIAGRAM
xxx M
xxx = Specific Device Code
M
= Date Code
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Peak Power Dissipation @ 20 ms (Note 1)
P
pk
225
W
ORDERING INFORMATION
@ T ≤ 25°C
L
†
Device*
Package
Shipping
Total Power Dissipation on FR−5 Board,
P
D
(Note 2) @ T = 75°C
Derated above 75°C
500
6.7
mW
mW/°C
MMSZ4xxxET1
SOD−123
3000/Tape & Reel
3000/Tape & Reel
L
MMSZ4xxxET1G SOD−123
(Pb−Free)
Thermal Resistance, (Note 3)
Junction−to−Ambient
R
340
°C/W
°C/W
°C
q
JA
MMSZ4xxxET3
SOD−123 10,000/Tape & Reel
Thermal Resistance, (Note 3)
Junction−to−Lead
R
q
JL
150
MMSZ4xxxET3G SOD−123 10,000/Tape & Reel
(Pb−Free)
Junction and Storage Temperature Range
T , T
J
−55 to
+150
stg
*The “T1” suffix refers to an 8 mm, 7 inch reel.
The “T3” suffix refers to an 8 mm, 13 inch reel.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Nonrepetitive current pulse per Figure 11.
2. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.
3. Thermal Resistance measurement obtained via infrared Scan Method.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
Devices listed in bold, italic are ON Semiconductor
Preferred devices. Preferred devices are recommended
choices for future use and best overall value.
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
February, 2005 − Rev. 3
MMSZ4678ET1/D