MMSZxxxT1G Series,
SZMMSZxxxT1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
Features
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 2.4 V to 56 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (> 16 kV) per Human Body Model
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
SOD−123
CASE 425
STYLE 1
1
2
Cathode
Anode
Pb−Free Packages are Available*
MARKING DIAGRAM
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
xx M G
1
G
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
xx = Device Code
M
= Date Code
G
= Pb−Free Package
MAXIMUM RATINGS
(Note: Microdot may be in either location)
Rating
Symbol
Max
Unit
ORDERING INFORMATION
Total Power Dissipation on FR−5 Board,
P
D
(Note 1) @ T = 75C
500
6.7
mW
mW/C
L
†
Device
Package
Shipping
Derated above 75C
MMSZxxxT1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel
Thermal Resistance, Junction−to−Ambient
R
340
C/W
C/W
C
q
JA
(Note 2)
SZMMSZxxxT1G SOD−123
(Pb−Free)
3,000 /
Tape & Reel
Thermal Resistance, Junction−to−Lead
(Note 2)
R
JL
150
q
MMSZxxxT3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel
Junction and Storage Temperature Range T , T
−55 to +150
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 3.5 X 1.5 inches.
SZMMSZxxxT3G SOD−123
(Pb−Free)
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
2. Thermal Resistance measurement obtained via infrared Scan Method.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
January, 2012 − Rev. 11
MMSZ2V4T1/D