MMSZ2V4ET1 Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
Specification Features
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 2.4 V to 56 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 X 20 ms)
1
2
Cathode
Anode
2
Mechanical Characteristics
1
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
SOD−123
CASE 425
STYLE 1
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MARKING DIAGRAM
xx M
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Peak Power Dissipation @ 20 ms (Note 1)
P
pk
225
Watts
xx = Specific Device Code
@ T ≤ 25°C
L
M
= Date Code
Total Power Dissipation on FR−5 Board,
P
D
(Note 2) @ T = 75°C
500
6.7
mW
mW/°C
L
Derated above 75°C
ORDERING INFORMATION
Thermal Resistance −
Junction−to−Ambient (Note 3)
R
340
°C/W
°C/W
°C
q
JA
†
Device
Package
Shipping
Thermal Resistance −
Junction−to−Lead (Note 3)
R
q
JL
150
MMSZxxxET1
MMSZxxxET3
SOD−123
3000/Tape & Reel
SOD−123 10,000/Tape & Reel
Junction and Storage
Temperature Range
T , T
J
−55 to
+150
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. Nonrepetitive current pulse per Figure 11
2. FR−5 = 3.5 X 1.5 inches, using the On minimum recommended footprint as
shown in Figure 12.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
3. Thermal Resistance measurement obtained via infrared Scan Method
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
June, 2004 − Rev. 1
MMSZ2V4ET1/D