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MMBZ5251BW PDF预览

MMBZ5251BW

更新时间: 2024-11-12 12:33:07
品牌 Logo 应用领域
TYSEMI 二极管测试
页数 文件大小 规格书
3页 165K
描述
Planar Die Construction

MMBZ5251BW 数据手册

 浏览型号MMBZ5251BW的Datasheet PDF文件第2页浏览型号MMBZ5251BW的Datasheet PDF文件第3页 
Product specification  
MMBZ5251BW  
Features  
Planar Die Construction  
General Purpose, Medium Current  
Ideally Suited for Automated Assembly Processes  
Absolute Maximum Ratings Ta = 25  
Parameter  
Symbol  
VF  
Rating  
0.9  
Unit  
V
Forward Voltage  
@ IF = 10mA  
Power Dissipation *1  
Pd  
200  
mW  
/W  
Thermal Resistance, Junction to Ambient Air *1  
Operating and Storage Temperature Range  
R
JA  
625  
Tj, TSTG  
-65 to +150  
*1. Part mounted on FR-4 PC board with recommended pad layout  
Electrical Characteristics @TA=25 unless otherwise specified  
Maximum ZenerImpedance  
*2  
Maximum Reverse  
Leakage Current *1  
Zener Voltage Range *1  
Type Number  
ZZK @ IZK=  
ZZT @ IZT  
Vz @IZT  
IZT  
IR  
@ VR  
0.25mA  
Nom (V)  
22  
Min (V)  
20.9  
Max (V)  
23.1  
mA  
5.6  
uA  
V
MMBZ5251BW  
29  
600  
0.1  
17  
*1. Short duration test pulse used to minimize self-heating effect.  
*2. f = 1KHz.  
Marking  
Marking  
KK1  
http://www.twtysemi.com  
sales@twtysemi.com  
4008-318-123  
1 of 3  

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