MMBZ52xxELT1G Series,
SZMMBZ52xxELT1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
http://onsemi.com
3
1
Cathode
Anode
Features
• 225 mW Rating on FR−4 or FR−5 Board
• Zener Voltage Range − 2.4 V to 91 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 x 20 ms)
MARKING
DIAGRAM
3
SOT−23
CASE 318
STYLE 8
Bxx M G
G
1
• AEC−Q101 Qualified and PPAP Capable
2
1
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
• Pb−Free Packages are Available
Bxx = Device Code
xx
M
G
= (Refer to page 2)
= Date Code*
= Pb−Free Package
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
ORDERING INFORMATION
MAXIMUM RATINGS
†
Device
MMBZ52xxELT1G
Package
Shipping
Rating
Symbol
Max
Unit
SOT−23
(Pb−Free)
3000 / Tape &
Reel
Peak Power Dissipation @ 20 ms (Note 1)
P
pk
225
W
@ T ≤ 25°C
L
SZMMBZ52xxELT1G SOT−23
(Pb−Free)
3000 / Tape &
Reel
Total Power Dissipation on FR−5 Board,
(Note 2) @ T = 25°C
Derated above 25°C
P
D
225
1.8
mW
mW/°C
A
MMBZ52xxELT3G
SOT−23
10000 / Tape &
Reel
(Pb−Free)
Thermal Resistance, Junction−to−Ambient
R
556
°C/W
q
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Total Power Dissipation on Alumina
P
D
Substrate, (Note 3) @ T = 25°C
300
2.4
mW
mW/°C
A
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
R
417
°C/W
°C
q
JA
T , T
J
−65 to
stg
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 9.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
December, 2011 − Rev. 7
MMBZ5221ELT1/D