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MMBZ5238BLG PDF预览

MMBZ5238BLG

更新时间： 2024-10-29 18:55:55
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管
页数 文件大小 规格书
6页 72K
描述
8.7V, 0.225W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236, LEAD FREE, SOT-23, PLASTIC, 2 PIN

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中文翻译

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MMBZ5238BLG 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：SOT-23
包装说明：R-PDSO-G3针数：3
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：5.27
配置：SINGLE二极管元件材料：SILICON
二极管类型：ZENER DIODEJEDEC-95代码：TO-236
JESD-30 代码：R-PDSO-G3JESD-609代码：e3
元件数量：1端子数量：3
最高工作温度：150 °C最低工作温度：-65 °C
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：260
极性：UNIDIRECTIONAL最大功率耗散：0.225 W
认证状态：Not Qualified标称参考电压：8.7 V
表面贴装：YES技术：ZENER
端子面层：MATTE TIN端子形式：GULL WING
端子位置：DUAL处于峰值回流温度下的最长时间：40
最大电压容差：5.05%工作测试电流：20 mA
Base Number Matches：1

MMBZ5238BLG 数据手册

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MMBZ5221BLT1 Series  
Preferred Device  
Zener Voltage Regulators  
225 mW SOT−23 Surface Mount  
This series of Zener diodes is offered in the convenient, surface  
mount plastic SOT−23 package. These devices are designed to provide  
voltage regulation with minimum space requirement. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
Features  
3
1
• 225 mW Rating on FR−4 or FR−5 Board  
Cathode  
Anode  
• Zener Voltage Range − 2.4 V to 91 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• ESD Rating of Class 3 (>16 KV) per Human Body Model  
• Pb−Free Packages are Available  
MARKING  
DIAGRAM  
3
SOT−23  
CASE 318  
STYLE 8  
Mechanical Characteristics  
xxx  
G
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
G
1
2
xxx  
M
= Specific Device Code  
= Date Code  
= Pb−Free Package  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
G
(Note: Microdot may be in either location)  
MAXIMUM RATINGS  
ORDERING INFORMATION  
Rating  
Symbol  
Max  
Unit  
Total Power Dissipation on FR−5 Board,  
P
D
†
Device**  
MMBZ52xxBLT1  
Package  
Shipping  
(Note 1) @ T = 25°C  
225  
1.8  
mW  
mW/°C  
A
SOT−23  
3000/Tape & Reel  
Derated above 25°C  
Thermal Resistance,  
Junction−to−Ambient  
R
556  
°C/W  
q
JA  
MMBZ52xxBLT1G SOT−23  
(Pb−Free)  
3000/Tape & Reel  
Total Power Dissipation on Alumina  
P
D
MMBZ52xxBLT3  
SOT−23 10,000/Tape & Reel  
Substrate, (Note 2) @ T = 25°C  
300  
2.4  
mW  
mW/°C  
A
Derated above 25°C  
MMBZ52xxBLT3G SOT−23 10,000/Tape & Reel  
(Pb−Free)  
Thermal Resistance,  
Junction−to−Ambient  
R
417  
°C/W  
°C  
q
JA  
**The “T1” suffix refers to an 8 mm, 7 inch reel.  
The “T3” suffix refers to an 8 mm, 13 inch reel.  
Junction and Storage  
Temperature Range  
T , T  
J
−65 to +150  
stg  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
1. FR−5 = 1.0 X 0.75 X 0.62 in.  
2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
Devices listed in bold, italic are ON Semiconductor  
Preferred devices. Preferred devices are recommended  
choices for future use and best overall value.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
May, 2005 − Rev. 8  
MMBZ5221BLT1/D  
 
123456

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