MMBD4448HTM
Lead-free Green
SURFACE MOUNT FAST SWITCHING DIODE ARRAY
Features
·
·
·
·
·
·
Fast Switching Speed
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
A
SOT-26
Dim Min Max Typ
A
B
C
D
F
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
C
B
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
Mechanical Data
H
¾
¾
0.95
0.55
·
Case: SOT-26
K
¾
¾
M
·
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
H
J
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
J
F
L
D
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
K
L
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
M
a
0°
8°
¾
·
·
·
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Ordering Information on Page 2
Orientation: See Diagram
TOP VIEW
All Dimensions in mm
Marking: KAD (See Page 2)
Weight: 0.016 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
Value
Unit
VRM
Non-Repetitive Peak Reverse Voltage
100
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
80
VR(RMS)
IFM
RMS Reverse Voltage
57
V
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
500
250
mA
mA
IO
Non-Repetitive Peak Forward Surge Current @ t = 1.0ms
4.0
2.0
IFSM
Pd
A
@ t = 1.0s
Power Dissipation (Note 1)
350
357
mW
°C/W
°C
R
qJA
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Tj , TSTG
-65 to +150
Electrical Characteristics @ T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Max
Unit
Test Condition
V(BR)R
Reverse Breakdown Voltage (Note 2)
IR = 2.5mA
80
¾
V
IF = 5.0mA
IF = 10mA
IF = 100mA
IF = 150mA
0.62
¾
0.72
0.855
1.0
VF
Forward Voltage
V
¾
¾
1.25
VR = 70V
100
50
nA
mA
mA
nA
VR = 75V, Tj = 150°C
VR = 25V, Tj = 150°C
VR = 20V
IR
Reverse Current (Note 2)
¾
30
25
VR = 6, f = 1.0MHz
VR = 6V, IF = 5mA
CT
trr
Total Capacitance
¾
¾
3.5
4.0
pF
ns
Reverse Recovery Time
Notes:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch, pad layout as shown on Diodes Inc. suggested pad layout AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product
manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30302 Rev. 5 - 2
1 of 3
MMBD4448HTM
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ã Diodes Incorporated