MMBD4448HT /HTA /HTC /HTS
SURFACE MOUNT FAST SWITCHING DIODE
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Features
Mechanical Data
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Ultra-Small Surface Mount Package
Fast Switching Speed
For General Purpose Switching Applications
High Conductance
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Notes 3 and 4)
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Case: SOT-523
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
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Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
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Polarity: See Diagrams Below
Marking Information: See Diagrams Below & Page 2
Ordering Information: See Page 2
Weight: 0.002 grams (approximate)
SOT-523
TOP VIEW
MMBD4448HT Marking: A3
MMBD4448HTA Marking: A6
MMBD4448HTC Marking: A7
MMBD4448HTS Marking: AB
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Value
Unit
Non-Repetitive Peak Reverse Voltage
100
V
VRM
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
80
V
RMS Reverse Voltage
57
V
VR(RMS)
IFM
Forward Continuous Current
(Note 1)
(Note 1)
500
250
4.0
2.0
mA
mA
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
IO
@ t = 1.0μs
@ t = 1.0s
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation
Symbol
PD
Value
150
Unit
mW
(Note 1)
(Note 1)
Thermal Resistance Junction to Ambient
Operating and Storage Temperature Range
833
°C/W
°C
Rθ
JA
-65 to +150
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Reverse Breakdown Voltage
Symbol
V(BR)R
Min
80
Max
⎯
Unit
V
Test Condition
IR = 2.5μA
(Note 5)
IF = 5.0mA
IF = 10mA
IF = 100mA
IF = 150mA
0.62
⎯
⎯
0.72
0.855
1.0
Forward Voltage
Leakage Current
V
VF
1.25
⎯
VR = 70V
nA
μA
μA
nA
100
50
30
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
(Note 5)
IR
⎯
25
Total Capacitance
Reverse Recovery Time
3.5
4.0
pF
ns
CT
trr
⎯
⎯
VR = 6V, f = 1.0MHz
VR = 6V, IF = 5mA
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. Short duration pulse test used to minimize self-heating effect.
1 of 3
www.diodes.com
March 2009
© Diodes Incorporated
MMBD4448HT /HTA /HTC /HTS
Document number: DS30263 Rev. 12 - 2
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