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MMB020750R250DBLK PDF预览

MMB020750R250DBLK

更新时间： 2024-11-04 05:49:19
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TTELEC /
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3页 148K
描述
Metal Glaze General Purpose Surface Mount Power Resistor

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MMB020750R250DBLK 数据手册

 浏览型号MMB020750R250DBLK的Datasheet PDF文件第2页浏览型号MMB020750R250DBLK的Datasheet PDF文件第3页 
Metal Glaze™ General Purpose  
Surface Mount Power Resistor  
™
Metal Glaze thick  
film element fired  
at 1000°C to solid  
ceramic substrate  
MM Series  
• Up to 2 watts  
• Up to 1000 volts  
High  
• 0.1 ohm to 2.2 megohm range  
• 150°C maximum operating temperature  
temperature  
dielectric  
coating  
60/40 Solder  
over nickel barrier  
Electrical Data  
Maximum  
Power  
Rating  
Resistance  
Range  
(ohms)  
Size  
Industry  
IRC  
Working  
Voltage²  
Tolerance  
(+%)³  
TCR  
(ppm/°C)³  
Product  
Category  
Code Footprint  
Type  
0.1 to 0.99  
1.0 to 1.0M  
20 to 348K  
0.1 to 0.99  
1.0 to 2.21M  
20 to 348K  
0.1 to 0.99  
1.0 to 2.21M  
1, 2, 5  
1, 2, 5  
100  
Low Range  
Standard  
B
1206  
MMA0204  
1/2  
400  
50, 100  
50, 100  
100  
0.25, 0.5  
1, 2, 5  
Tight Tolerance  
Low Range  
Standard  
F
2512  
3610  
MMB0207  
MMC0310  
1
2
700  
1, 2, 5  
50, 100  
50, 100  
100  
0.25, 0.5  
1, 2, 5  
Tight Tolerance  
Low Range  
Standard  
H
1000  
1, 2, 5  
50, 100  
¹Not to exceed √P x R ²Consult factory for tighter TCR, tolerance, or resistance values.  
Environmental Data  
Characteristics  
Maximum Change  
Test Method  
Temperature Coefficient  
As specified  
MIL-R-55342E Par 4.7.9 (-55°C +125°C)  
Thermal Shock  
0.5ꢀ +0.01Ω  
0.25ꢀ +0.01Ω  
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)  
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)  
Low Temperature Operation  
MIL-R-55342E Par 4.7.5  
0.5ꢀ +0.01Ω  
1ꢀ for R>100KΩ  
Short Time Overload  
2.5 x √P x R for 5 seconds  
High Temperature Exposure  
Resistance to Bonding Exposure  
Solderability  
0.5ꢀ +0.01Ω  
0.25ꢀ +0.01Ω  
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)  
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds)  
95ꢀ minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)  
Moisture Resistance  
Life Test  
0.5ꢀ +0.01Ω  
0.5ꢀ +0.01Ω  
1ꢀ +0.01Ω  
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)  
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)  
1200 gram push from underside of mounted chip for  
Terminal Adhesion Strength  
Resistance to Board Bending  
no mechanical damage 60 seconds  
0.5ꢀ +0.01Ω  
Chip mounted in center of 90mm long board, deflected 5mm  
no mechanical damage so as to exert pull on chip contacts for 10 seconds  
General Note  
IRC reserves the right to make changes in product specification without notice or liability.  
All information is subject to IRC’s own data and is considered accurate at time of going to print.  
A subsidiary of  
TT electronics plc  
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA  
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com  
MM Series Issue March 2009 Sheet 1 of 3  
123

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