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MM74HC540_05 PDF预览

MM74HC540_05

更新时间: 2024-11-03 05:08:31
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 102K
描述
Inverting Octal 3-STATE Buffer Octal 3-STATE Buffer

MM74HC540_05 数据手册

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September 1983  
Revised May 2005  
MM74HC540 MM74HC541  
Inverting Octal 3-STATE Buffer Octal 3-STATE Buffer  
General Description  
Features  
The MM74HC540 and MM74HC541 3-STATE buffers uti-  
lize advanced silicon-gate CMOS technology. They pos-  
sess high drive current outputs which enable high speed  
operation even when driving large bus capacitances.  
These circuits achieve speeds comparable to low power  
Schottky devices, while retaining the advantage of CMOS  
circuitry, i.e., high noise immunity, and low power consump-  
tion. Both devices have a fanout of 15 LS-TTL equivalent  
inputs.  
Typical propagation delay: 12 ns  
3-STATE outputs for connection to system buses  
Wide power supply range: 2–6V  
Low quiescent current: 80 A maximum (74HC Series)  
Output current: 6 mA  
The MM74HC540 is an inverting buffer and the  
MM74HC541 is a non-inverting buffer. The 3-STATE con-  
trol gate operates as a two-input NOR such that if either G1  
or G2 are HIGH, all eight outputs are in the high-imped-  
ance state.  
In order to enhance PC board layout, the MM74HC540 and  
MM74HC541 offers a pinout having inputs and outputs on  
opposite sides of the package. All inputs are protected from  
damage due to static discharge by diodes to VCC and  
ground.  
Ordering Code:  
Order Number Package Number  
Package Description  
MM74HC540WM  
MM74HC540SJ  
MM74HC540MTC  
MM74HC540N  
M20B  
M20D  
MTC20  
N20A  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
MM74HC541WM  
MM74HC541SJ  
MM74HC541MTC  
MM74HC541N  
M20B  
M20D  
MTC20  
N20A  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Connection Diagrams  
Pin Assignments for DIP, SOIC, SOP and TSSOP  
Top View  
MM74HC541  
Top View  
MM74HC540  
© 2005 Fairchild Semiconductor Corporation  
DS005341  
www.fairchildsemi.com  

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