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MM74HC4050NX PDF预览

MM74HC4050NX

更新时间: 2024-11-26 05:08:31
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飞兆/仙童 - FAIRCHILD /
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6页 72K
描述
Hex Inverting Logic Level Down Converter . Hex Logic Level Down Converter

MM74HC4050NX 数据手册

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February 1984  
Revised October 1999  
MM74HC4049 • MM74HC4050  
Hex Inverting Logic Level Down Converter •  
Hex Logic Level Down Converter  
ple buffer or inverter without level translation. The  
MM74HC4049 is pin and functionally compatible to the  
CD4049BC and the MM74HC4050 is compatible to the  
CD4050BC  
General Description  
The MM74HC4049 and the MM74HC4050 utilize  
advanced silicon-gate CMOS technology, and have a mod-  
ified input protection structure that enables these parts to  
be used as logic level translators which will convert high  
level logic to a low level logic while operating from the low  
logic supply. For example, 0–15V CMOS logic can be con-  
verted to 0–5V logic when using a 5V supply. The modified  
input protection has no diode connected to VCC, thus allow-  
Features  
Typical propagation delay: 8 ns  
Wide power supply range: 2V–6V  
Low quiescent supply current: 20 µA maximum (74HC)  
Fanout of 10 LS-TTL loads  
ing the input voltage to exceed the supply. The lower zener  
diode protects the input from both positive and negative  
static voltages. In addition each part can be used as a sim-  
Ordering Code:  
Order Number  
Package Number Package Description  
MM74HC4049M  
MM74HC4049SJ  
MM74HC4049MTC  
MM74HC4049N  
MM74HC4050M  
MM74HC4050SJ  
MM74HC4050MTC  
MM74HC4050N  
M16A  
M16D  
MTC16  
N16E  
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow  
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide  
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide  
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow  
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
M16A  
M16D  
MTC16  
N16E  
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide  
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Connection Diagrams  
MM74HC4049  
MM74HC4050  
© 1999 Fairchild Semiconductor Corporation  
DS005214  
www.fairchildsemi.com  

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