Zener Voltage Regulators
500 mW, Low IZ SOD−523 Surface Mount
MM5Z4xxxTxG Series,
SZMM5Z4xxxTxG Series
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
www.onsemi.com
Features
SOD−523
CASE 502
STYLE 1
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 1.8 V to 43 V
• Low Reverse Current (I ) − 50 mA
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
ZT
1
2
Cathode
Anode
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
MARKING DIAGRAM
XX M G
• These Devices are Pb−Free and are RoHS Compliant*
G
2
1
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
XX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
*Date Code orientation may vary depending up-
on manufacturing location.
MAXIMUM RATINGS
ORDERING INFORMATION
Rating
Symbol
Max
Units
†
Device
Package
Shipping
Total Power Dissipation on FR−5 Board,
P
D
MM5Z4xxxT1G
SOD−523
(Pb−Free)
3,000 /
Tape & Reel
(Note 1) @ T = 75°C
500
4.0
mW
mW/°C
L
Derated above 75°C
SZMM5Z4xxxT1G SOD−523
(Pb−Free)
3,000 /
Tape & Reel
Thermal Resistance, (Note 2)
Junction−to−Ambient
R
°C/W
q
JA
250
MM5Z4xxxT5G
SOD−523
(Pb−Free)
8,000 /
Tape & Reel
Junction and Storage Temperature Range
T , T
−55 to
+150
°C
J
stg
SZMM5Z4xxxT5G SOD−523
(Pb−Free)
8,000 /
Tape & Reel
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
November, 2020 − Rev. 3
MM5Z4678T1/D