MM3Z3V3ST1 SERIES
Zener Voltage Regulators
200 mW SOD−323 Surface Mount
Tight Tolerance Portfolio
This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 200 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand−held portables,
and high density PC boards.
http://onsemi.com
1
2
Cathode
Anode
MARKING
DIAGRAM
Specification Features:
• Standard Zener Breakdown Voltage Range −
3.3 V to 36 V
• Steady State Power Rating of 200 mW
2
XXMG
1
G
• Small Body Outline Dimensions:
0.067″ x 0.049″ (1.7 mm x 1.25 mm)
• Low Body Height: 0.035″ (0.9 mm)
SOD−323
CASE 477
STYLE 1
XX= Specific Device Code
M = Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary
depending upon manufacturing location.
• Package Weight: 4.507 mg/unit
• ESD Rating of Class 3 (>16 kV) per Human Body Model
G
• Tight Tolerance V
Z
• Pb−Free Packages are Available
Mechanical Characteristics:
ORDERING INFORMATION
CASE: Void-free, transfer-molded plastic
FINISH: All external surfaces are corrosion resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
LEADS: Plated with Pb−Sn or Sn only (Pb−Free)
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MOUNTING POSITION: Any
†
Device
Package
Shipping
MM3ZxxxST1
MM3ZxxxST1G
SOD−323
3000/Tape & Reel
3000/Tape & Reel
SOD−323
(Pb−Free)
MM3ZxxxST3
SOD−323 10,000/Tape & Reel
MM3ZxxxST3G
SOD−323 10,000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
P
D
(Note 1) @ T = 25°C
200
1.5
mW
mW/°C
A
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
Derate above 25°C
Thermal Resistance from
R
635
°C/W
q
JA
Junction−to−Ambient
Junction and Storage
Temperature Range
T , T
−65 to +150
°C
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
October, 2009 − Rev. 16
MM3Z2V4ST1/D