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MM3Z10VST1G PDF预览

MM3Z10VST1G

更新时间: 2024-11-20 12:28:23
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器
页数 文件大小 规格书
5页 107K
描述
Zener Voltage Regulators

MM3Z10VST1G 数据手册

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MM3ZxxxST1G Series,  
SZMM3ZxxxST1G Series  
Zener Voltage Regulators  
200 mW SOD323 Surface Mount  
Tight Tolerance Portfolio  
http://onsemi.com  
This series of Zener diodes is packaged in a SOD323 surface  
mount package that has a power dissipation of 200 mW. They are  
designed to provide voltage regulation protection and are especially  
attractive in situations where space is at a premium. They are well  
suited for applications such as cellular phones, handheld portables,  
and high density PC boards.  
SOD323  
CASE 477  
STYLE 1  
Specification Features  
Standard Zener Breakdown Voltage Range 3.3 V to 36 V  
Steady State Power Rating of 200 mW  
Small Body Outline Dimensions:  
0.067x 0.049(1.7 mm x 1.25 mm)  
Low Body Height: 0.035(0.9 mm)  
Package Weight: 4.507 mg/unit  
1
2
Cathode  
Anode  
MARKING DIAGRAM  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
Tight Tolerance V  
Z
XXMG  
AECQ101 Qualified and PPAP Capable  
G
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant*  
XX= Specific Device Code  
M = Date Code*  
G
= PbFree Package  
Mechanical Characteristics:  
(Note: Microdot may be in either location)  
CASE: Void-free, transfer-molded plastic  
FINISH: All external surfaces are corrosion resistant  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
LEADS: Plated with PbSn or Sn only (PbFree)  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V0  
MOUNTING POSITION: Any  
*Date Code orientation may vary  
depending upon manufacturing location.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MM3ZxxxST1G  
SOD323  
(PbFree)  
3,000 /  
Tape & Reel  
SZMM3ZxxxST1G SOD323  
(PbFree)  
3,000 /  
Tape & Reel  
MM3ZxxxST3G  
SOD323  
(PbFree)  
10,000 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
June, 2013 Rev. 20  
MM3Z2V4ST1/D  

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