Datasheet > MLX91210

MLX91210

更新时间： 2022-02-26 11:00:14

品牌	Logo	应用领域
迈来芯 - MELEXIS		/
页数	文件大小	规格书
18页	1342K
描述
MLX91210 Integrated Current Sensor IC

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MLX91210 数据手册

MLX91210 Integrated Current Sensor IC

Datasheet

Features and Benefits

Applications

Factory trimmed AC and DC current sensor

Household/Appliance Smart Metering

Analog ratiometric output voltage

Electric Motor Control

Combining sensing element, signal

conditioning & isolation in small footprint

and low profile SOIC package

Demand Response Load Control

Servers / Motherboard monitoring

Switched Mode Power Supplies

No application programming required

High speed sensing

DC to 100kHz bandwidth

5µs response time

Description

The MLX91210 is an Integrated Current Sensor

that senses the current flowing through the

leadframe of the SOIC package. The current

conductor exhibits low power dissipation (0.7 -

0.8mΩ). By virtue of fixing the current conductor

position with respect to the monolithic CMOS

sensor, a fully integrated Hall-effect current

sensor is obtained, that is factory calibrated.

Robust against external magnetic fields

No magnetic hysteresis

Low ohmic losses of integrated conductor

0.8mΩ SOIC-8 / 0.7mΩ SOIC-16

SOIC-8 narrow body and SOIC-16 wide

body package, RoHS compliant

Lead free component, suitable for lead

free soldering profile up to 260°C, MSL3

Inside the package, the magnetic flux density

generated by the current flow is sensed

differentially by two sets of Hall plates. As a result

the influence of external disturbing fields

originating from the dense power electronics

surrounding the IC is minimized in the fast analog

front-end. The residual signal is amplified to

provide a high-speed linear analog output voltage.

Rated voltage isolation

2.1kV_RMSfor SOIC-8

2.5kVrms for SOIC-16

The close proximity of the Hall plates to the

current conductor ensures a high signal-to-noise

ratio and an accurate signal over temperature.

With this miniaturization, high voltage isolation

ratings are still maintained between the primary

and their opposing secondary side leads of the

package.

SOIC-8

SOIC-16

IEC60950-1:2005

+ Am 1:2009 & 2:2013 + Am 1:2009 & 2:2013

N/A

UL1577

12 3 4 5 6 7...18

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