是否Rohs认证: | 不符合 | 生命周期: | Active |
包装说明: | TSOP, | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.14 | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | R-PDSO-G3 |
JESD-609代码: | e0 | 长度: | 2.86 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 3 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度): | 240 | 认证状态: | Not Qualified |
座面最大高度: | 1.15 mm | 最大供电电压 (Vsup): | 3.63 V |
最小供电电压 (Vsup): | 2.97 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | GULL WING |
端子节距: | 1.9 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 1.295 mm |
Base Number Matches: | 1 |
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