是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | TSOP, TO-236 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.66 | 其他特性: | SEATED HT-CALCULATED |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PDSO-G3 | JESD-609代码: | e4 |
长度: | 2.92 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 3 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP | 封装等效代码: | TO-236 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
座面最大高度: | 1.11 mm | 最大供电电流 (Isup): | 0.01 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.6 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 0.95 mm |
端子位置: | DUAL | 阈值电压标称: | +2.93V |
宽度: | 1.3 mm | Base Number Matches: | 1 |
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