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MIC-6313 PDF预览

MIC-6313

更新时间: 2024-11-12 01:12:47
品牌 Logo 应用领域
研华 - ADVANTECH /
页数 文件大小 规格书
2页 818K
描述
OpenVPX CPU Blade with Intel® 4th/ 5th Generation Core® Processor

MIC-6313 数据手册

 浏览型号MIC-6313的Datasheet PDF文件第2页 
OpenVPX CPU Blade with Intel® 4th/ 5th  
Generation Core® Processor  
MIC-6313  
Features  
Preliminary  
ƒ 5th Generation Intel® Core® processor, up to 4 cores / 8 threads  
ƒ Intel® QM87 PCH  
ƒ Triple independent display support  
ƒ OpenVPX MOD6-PAY-4F1Q2U2T-12.2.1-2 profile compliant  
ƒ Onboard and SO-DIMM DDR3L-1600, up to 16 GB, with ECC support  
ƒ Four SRIOx4 ports and two PCIex8 ports on Fabric interface  
ƒ Four 1000BASE-T ports on Base interface (two configurable to SERDES)  
ƒ Two 1000BASE-T front panel ports  
ƒ One CFast and one onboard flash storage device  
RoHS  
COMPLIANT  
2002/95/EC  
Introduction  
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the Intel® 4th/ 5th Generation Core® and Xeon® E3 Lv4 embedded platform. To enable the  
highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to  
5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the  
VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and  
additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining  
maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the Intel® 4th/ 5th Generation Core® and Xeon®  
E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with  
outstanding floating point and vector processing performance.  
Tailored for rugged environments, the MIC-6313 has a native conduction-cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink,  
additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a cost-efficient,  
modular storage. By using Intel’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard  
XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data  
rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by intel’s latest Gigabit Ethernet controller.  
Intel’s next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented  
by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides  
media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE  
ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.  
Specifications  
CPU  
Max. Speed  
Chipset  
Intel E3-12x8Lv4/ i7-5xx0EQ / i5-4402E  
3.3 GHz  
Intel Lynx Point (QM87)  
Processor System  
BIOS  
Redundant AMI UEFI based 8MByte SPI flash  
Dual channel DDR3L 1600MHz w/ ECC  
Configurable up to 16 GB  
8GB memory soldered onboard, 1x 204-pin SODIMM socket max. to 8GB  
4x SRIOx4 Gen2  
Technology  
Max. Capacity  
Socket  
Memory  
P1  
P2  
2x PCIex8 (1 port NT Capable)  
VPX Interface  
P4  
P5  
P6  
8d+12d XMC IO;, 2x 10/100/1000BT (alternative of SerDes) from I350  
2x USB3.0; 2x USB 2.0; 3x SATA-III; DVI x2; 2x UART(RS-232/422/485 switchable)  
2x 10/100/1000BT; Audio from ALC892; 2x USB 2.0; KB/Mouse from SIO;1x SATA II  
Intel embedded graphic controller Iris (3 independent displays)  
Intel I350-AM4 Quad Port Gigabit Ethernet Controller to backplane; 2x I210 to front panel  
1 RS-232 on RJ-45 connector,  
Graphics  
Ethernet  
Controller  
Controller  
Serial (COM)  
Ethernet  
USB  
2 x RJ-45 10/100/1000BASE-T  
2x USB 3.0, 1x USB2.0  
Front I/O Interface  
Miscellaneous  
Compatibility  
CFast  
Onboard Flash  
Consumption  
PCB Dimensions  
Weight  
XMC, DVI  
Linux; Windows7  
SATA III  
64G SATAII  
To-be-measured W total power envelope with 47W CPU  
6HP, 233.35 x 160 mm (9.2" x 6.3") (W x D)  
0.95kg without peripherals  
Operating System  
Storage  
Power Requirement  
Physical Characteristics  
All product specifications are subject to change without notice  
Last updated : 28-Oct-2015  

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