5秒后页面跳转
MH1608R18JLA PDF预览

MH1608R18JLA

更新时间: 2024-10-02 04:54:23
品牌 Logo 应用领域
ABC 电感器
页数 文件大小 规格书
6页 100K
描述
General Purpose Inductor, 0.18uH, 5%, 0603,

MH1608R18JLA 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:0603Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8504.50.80.00
风险等级:5.31大小写代码:0603
构造:Multilayer Chip直流电阻:2.7 Ω
标称电感 (L):0.18 µH电感器类型:GENERAL PURPOSE INDUCTOR
最高工作温度:125 °C最低工作温度:-55 °C
封装高度:0.8 mm封装长度:1.6 mm
封装形式:SMT封装宽度:0.8 mm
包装方法:Bulk最小质量因数(标称电感时):8
最大额定电流:0.25 A自谐振频率:520 MHz
系列:MH1608-L容差:5%

MH1608R18JLA 数据手册

 浏览型号MH1608R18JLA的Datasheet PDF文件第2页浏览型号MH1608R18JLA的Datasheet PDF文件第3页浏览型号MH1608R18JLA的Datasheet PDF文件第4页浏览型号MH1608R18JLA的Datasheet PDF文件第5页浏览型号MH1608R18JLA的Datasheet PDF文件第6页 
SPECIFICATION FOR APPROVAL  
REF : 20100428-B  
PROD.  
PAGE: 1  
ABC'S DWG NO.  
ABC'S ITEM NO.  
MH1608□□□□L-□□□  
MULTILAYER CHIP INDUCTOR  
NAME  
Ⅰ﹒CONFIGURATION & DIMENSIONS:  
A
A
B
C
D
:
1.60±0.15  
m/m  
m/m  
m/m  
m/m  
:
0.80±0.15  
0.80±0.15  
0.30±0.20  
:
:
D
Ⅱ﹒SCHEMATIC DIAGRAM:  
Ⅲ﹒FEATURES:  
aMonolithic structure ensuring high performance and reliability.  
bHigh frequency applications up to 6GHz.  
cTerminalAg/Cu/Ni/Sn  
dRemarkProducts comply with RoHS' requirements  
Ⅳ﹒APPLICATIONS:  
aRF modules for telecommunication systems including  
GSM, PCS,DECT,WLAN,Bluetooth,etc.  
Ⅴ﹒GENERAL SPECIFICATION:  
Peak Temp260max.  
aStorage Conditions:  
Max time above 230℃ :50sec max.  
Max time above 200℃ :70sec max.  
Temperature  
Electrical Performance temp-55~ +125℃  
Terminal Solderability & Packages Material temp:  
-10~ +40and RH 70% max.  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
+2.0 ~ 4.0  
/ sec max.  
+4.0/ sec max.  
150 ~ 200/ 60 ~ 120sec  
-(1.0 ~ 5.0)/ sec max.  
Peak Temperature:  
260  
bOperating temp.-55---- +125℃  
cSolderability:  
250  
230℃  
50sec max.  
200  
150  
100  
50  
Solder : Sn96.5 / Ag3 / Cu0.5  
70sec max.  
or equivalent  
Solder temp. : 260±5℃  
Flux : Rosin  
Dip time : 4±1 seconds  
50  
100  
150  
Time ( seconds )  
200  
250  
0
AR-001A  

与MH1608R18JLA相关器件

型号 品牌 获取价格 描述 数据表
MH1616FNA-29 MITSUBISHI

获取价格

SRAM Module, 16KX16, 29ns, CMOS
MH16D64AKQC-10 MITSUBISHI

获取价格

1,073,741,824-BIT (16,777,216-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module
MH16D64AKQC-75 MITSUBISHI

获取价格

1,073,741,824-BIT (16,777,216-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module
MH16D64AKQJ-10 MITSUBISHI

获取价格

DDR DRAM Module, 16MX64, 0.8ns, CMOS, SODIMM-200
MH16D64AKQJ-75 MITSUBISHI

获取价格

DDR DRAM Module, 16MX64, 0.75ns, CMOS, SODIMM-200
MH16D72AKLB-10 MITSUBISHI

获取价格

1,207.959,552-BIT (16,777,216-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module
MH16D72AKLB-75 MITSUBISHI

获取价格

1,207.959,552-BIT (16,777,216-WORD BY 72-BIT) Double Data Rate Synchronous DRAM Module
MH16D72AKTB-10 MITSUBISHI

获取价格

DDR DRAM Module, 16MX72, 0.8ns, CMOS, DIMM-184
MH16EAD MTRONPTI

获取价格

Micro Peripheral IC
MH16EAD-FREQ-OUT29 MTRONPTI

获取价格

HCMOS/TTL Output Clock Oscillator, 1MHz Min, 67MHz Max, NICKEL HEADER, DIP-4