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MF-SMHT160 PDF预览

MF-SMHT160

更新时间: 2024-11-23 03:49:23
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
4页 324K
描述
MF-SMHT Series - PTC Resettable Fuses

MF-SMHT160 数据手册

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Features  
Operating temperature range up to 125 °C  
Low thermal derating factor  
Applications  
Protection of automotive circuitry  
including engine control modules  
Overcurrent surge protection of electronic  
equipment required to operate at high  
operating temperature ranges  
Resettable fault protection of general  
electronic equipment  
Higher hold currents at elevated  
1
3
temperature  
6
A
4
Choice of operating currents  
RoHS compliant*  
MF-SMHT Series - PTC Resettable Fuses  
Electrical Characteristics  
Tripped  
Power  
Dissipation  
Max. Time  
To Trip  
I
I
trip  
Resistance  
hold  
V max.  
Model  
I max.  
Amps  
Amperes  
at 23 °C  
Ohms  
at 23 °C  
Amperes  
at 23 °C  
Seconds  
at 23 °C  
Watts  
at 23 °C  
Volts  
R
R
Hold  
1.36  
1.60  
Trip  
2.72  
3.20  
Min.  
1Max.  
0.33  
Max.  
10.0  
10.0  
Typ.  
2.1  
2.1  
MF-SMHT136  
MF-SMHT160  
16  
16  
100  
100  
0.085  
0.050  
8.0  
8.0  
0.15  
Environmental Characteristics  
Operating Temperature..............................................................-40 °C to +125 °C  
Storage Temperature ................................................................-40 °C to +85 °C  
Passive Aging ............................................................................+125 °C, 1000 hours........................................................ 15 ꢀ typiꢁal resistanꢁe ꢁhange  
Humidity Aging ..........................................................................+85 °C, 85 ꢀ R.H. 7 days................................................ 15 ꢀ typiꢁal resistanꢁe ꢁhange  
Thermal Shoꢁk ..........................................................................MIL-STD-202F, Method 107G, ........................................ 15 ꢀ typiꢁal resistanꢁe ꢁhange  
+125 °C to -55 °C,10 ꢁyꢁles  
Vibration ....................................................................................MIL-STD-883C, Method 2007.1, Condition A..................No ꢁhange  
Test Procedures And Requirements For Model MF-SMHT Series  
Test  
Test Conditions  
Accept/Reject Criteria  
Visual/Meꢁh. ......................................Verify dimensions and materials............................................Per MF physiꢁal desꢁription  
Resistanꢁe..........................................In still air @ 23 °C ..................................................................Rmin R R1max  
Time to Trip ........................................At speꢁified ꢁurrent, Vmax, 23 °C ........................................T max. time to trip (seꢁonds)  
Hold Current ......................................30 min. at Ihold......................................................................No trip  
Trip Cyꢁle Life ....................................Vmax, Imax, 100 ꢁyꢁles ........................................................No arꢁing or burning  
Trip Enduranꢁe ..................................Vmax, 48 hours......................................................................No arꢁing or burning  
Solderability ......................................MIL-STD-202F, Method 208F................................................95 ꢀ min. ꢁoverage  
Thermal Derating Chart - I  
I
(Amps)  
hold / trip  
Ambient Operating Temperature  
23 °C 40 °C 50 °C  
Model  
-40 °C  
-20 °C  
0 °C  
60 °C  
70 °C  
85 °C  
125 °C  
MF-SMHT136  
MF-SMHT160  
1.91 / 3.82 1.72 / 3.44 1.54 / 3.08 1.36 / 2.72 1.18 / 2.36 1.09 / 2.18 1.00 / 2.00 0.91 / 1.82 0.77 / 1.54 0.40 / 0.80  
2.15 / 4.30 1.96 / 3.92 1.78 / 3.56 1.60 / 3.20 1.42 / 2.48 1.33 / 2.66 1.24 / 2.48 1.15 / 3.30 1.02 / 2.04 0.64 / 1.28  
Circuit Protection Division  
Asia-Pacific:  
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116  
Europe:  
Tel: +41-41 768 5555 • Fax: +41-41 768 5510  
The Americas:  
Tel: +1-951 781-5500 • Fax: +1-951 781-5700  
www.bourns.com  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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