Features
Applications
Used as a secondary overcurrent protection
device in:
■ Tip & ring line protection with two devices
in one package
■ Surface mount device
■ High voltage surge capabilities
■ Customer Premise Equipment (CPE)
■ Central Office (CO)
■ Assists in meeting ITU-T K.20/K.21/K.45
specifications as well as Telcordia GR-1089
intra-building
■ Subscriber Line Interface Cards (SLIC)
■ RoHS compliant*
MF-SD/250 Series - Telecom PTC Resettable Fuses
Electrical Characteristics
Max.
Interrupt
Ratings
1 Hour (R )
1
Tripped
Power
Dissipation
Watts
at 23 °C
Tꢁp.
Max.
Operating
Voltage
Initial
Resistance
Nominal Time
to Trip
Ihold
Itrip
Post-Trip
Resistance*
Ohms
Model
Amperes
at 23 °C
Hoꢂd
Ohms
at 23 °C
Amps
Seconds
at 23 °C
Volts
(V)
Amps
(A)
at 23 °C
Max.
at 23 °C
Volts
Trip
Min.
Max.
MF-SD013/250
60
250
3.0
0.13
0.26
2.0
7.0
10.0
1
2.0
1.5
* R vaꢂue is measured 24 hours post reflow.
1
Resistance matched in housing: 1.0 ohm measured 24 hours after reflow instaꢂꢂation.
Environmental Characteristics
Operating Temperature.................................... -45 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State............................................ 125 °C
Passive Aging.................................................. +85 °C, 1000 hours............................................... 15 ꢀ tꢁpicaꢂ resistance change
..................................................................... +60 °C, 1000 hours............................................... 15 ꢀ tꢁpicaꢂ resistance change
Humiditꢁ Aging................................................ +85 °C, 85 ꢀ R.H. 1000 hours............................. 15 ꢀ tꢁpicaꢂ resistance change
Thermaꢂ Shock ................................................ MIL-STD-202F, Method 107G, ............................. 10 ꢀ tꢁpicaꢂ resistance change
+125 °C to -55 °C,10 times
15 ꢀ tꢁpicaꢂ resistance change
Soꢂvent Resistance.......................................... MIL-STD-202, Method 215B ................................ No change
Lead Soꢂerabiꢂitꢁ.............................................. ANSI/J-STD-002
Fꢂammabiꢂitꢁ .................................................... IEC 695-2-2 .......................................................... No Fꢂame for 60 secs.
Vibration .......................................................... MIL-STD-883C, Method 2007.1, Condition A...... No change
Test Procedures And Requirements For Model MF-SD/250 Series
Test
Test Conditions
Accept/Reject Criteria
Visuaꢂ/Mech..................................................... Verifꢁ dimensions and materiaꢂs...................... Per MF phꢁsicaꢂ description
Resistance....................................................... In stiꢂꢂ air @ 23 °C............................................. Rmin ≤ R ≤ Rmax
Time to Trip...................................................... At specified current, Vmax, 23 °C ................... T ≤ max. time to trip (seconds)
Hoꢂd Current.................................................... 30 min. at Ihoꢂd................................................ No trip
Primary
Protection
Test
Test Conditions
Mains Power Contact - ITU-T K.20, K.21........ 230 V rms, 10 ohms, t = 15 min. ..................... None
Power Induction - ITU-T K.20, K.21................ 600V rms, 600 ohms, t = 0.2 seconds............. None
Power Induction - ITU-T K.20, K.21................ 600 V rms, 600 ohms, t = 1 second. ............... GDT
Lightning Surge - ITU-T K.20, K.21................. 1.5 KV, 10/700 μs............................................. None
Lightning Surge ............................................... 4.0 KV, 10/700 μs............................................. GDT
Thermal Derating Chart -I
(Amps)
hold
Ambient Operating Temperature
Model
-40 °C
-20 °C
0 °C
23 °C
40 °C
50 °C
60 °C
70 °C
85 °C
MF-SD013/250
0.21
0.18
0.16
0.13
0.10
0.09
0.08
0.07
0.05
Asia-Pacific: Teꢂ: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Teꢂ: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Teꢂ: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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