4 MEG x 16
EDO DRAM
4X16E43V
EDO DRAM
FEATURES
PIN ASSIGNMENT (To p Vie w )
50-Pin TSOP
• Sin gle +3.3V ±0.3V power supply
• In dustry-stan dard x16 pin out, tim in g, fun ction s,
an d package
• 12 row, 10 colum n addresses (4)
13 row, 9 colum n addresses (8)
VCC
DQ0
DQ1
DQ2
DQ3
VCC
DQ4
DQ5
DQ6
DQ7
NC
VCC
WE#
RAS#
NC
NC
NC
NC
A0
A1
A2
A3
A4
A5
VCC
1
2
3
4
5
6
7
8
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
VSS
DQ15
DQ14
DQ13
DQ12
VSS
DQ11
DQ10
DQ9
DQ8
NC
• High -perform an ce CMOS silicon -gate process
• All in puts, outputs an d clocks are LVTTL-com patible
• Exten ded Data-Out (EDO) PAGE MODE access
• 4,096-cycle CAS#-BEFORE-RAS# (CBR) REFRESH
distributed across 64m s
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
• Self refresh for low-power data reten tion
VSS
CASL#
CASH#
OE#
NC
NC
NC/A12†
A11
A10
A9
A8
A7
OPTIONS
MARKING
• Plastic Package
50-pin TSOP (400 m il)
TW
• Tim in g
50n s access
60n s access
-5
-6
A6
VSS
• Refresh Rates
4K
8K
†A12 for " 8K" version, NC for " 4K" version.
4
8
4X16E43V
4 Meg x 16
4X16E83V
Configuration
Refresh
4 Meg x 16
8K
• Operatin g Tem perature Ran ge
Com m ercial (0°C to +70°C)
Exten ded (-40°C to +85°C)
4K
Non e
IT
Row Address
Column Addressing
4K (A0-A11)
1K (A0-A9)
8K (A0-A12)
512 (A0-A8)
NOTE: 1. The “#” symbol indicates signal is active LOW.
4 MEG x 16 EDO DRAM PART NUMBERS
Part Number Example:
REFRESH
MEM4X16E43VTW-5
PART NUMBER
ADDRESSING
PACKAGE
4X16E43VTW-x
4X16E83VTW-x
4
8
400-TSOP
400-TSOP
KEY TIMING PARAMETERS
SPEED
t RC
84ns
104ns
t RAC
50ns
60ns
t PC
20ns
25ns
t AA
25ns
30ns
t CAC
13ns
15ns
t CAS
8ns
x = speed
-5
-6
10ns
1