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MEC1-108-02-F-D-NP-A PDF预览

MEC1-108-02-F-D-NP-A

更新时间: 2024-11-06 19:41:59
品牌 Logo 应用领域
申泰 - SAMTEC PC连接器
页数 文件大小 规格书
1页 291K
描述
Card Edge Connector,

MEC1-108-02-F-D-NP-A 技术参数

是否Rohs认证:符合生命周期:Active
Reach Compliance Code:compliantFactory Lead Time:2 weeks
风险等级:5.73Samacsys Confidence:4
Samacsys Status:ReleasedSamacsys PartID:2078087
Samacsys Pin Count:16Samacsys Part Category:Connector
Samacsys Package Category:OtherSamacsys Footprint Name:MEC1-108-02-F-D-NP-A-2
Samacsys Released Date:2019-12-11 11:02:28Is Samacsys:N
连接器类型:CARD EDGE CONNECTORBase Number Matches:1

MEC1-108-02-F-D-NP-A 数据手册

  
F-219 (Rev 29JAN20)  
MEC1–120–02–F–D–A  
MEC1–130–02–F–D–A  
MEC1–140–02–L–D  
(1.00 mm) .0394"  
MEC1 SERIES  
MINI EDGE CARD SOCKET  
Mates with  
(1.60 mm)  
.062" card  
Mates with:  
SPECIFICATIONS  
(1.60 mm) .062" card  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?MEC1  
APPLICATION  
Insulator Material:  
Black LCP  
Contact Material:  
BeCu  
Plating:  
Sn or Au over 50 µ"  
(1.27 µm) Ni  
Operating Temp Range:  
-55 °C to +125 °C  
Current Rating:  
2.2 A per pin  
(2 adjacent pins powered)  
Voltage Rating:  
250 VAC  
Insertion Depth:  
(5.84 mm) .230" to  
HIGH-SPEED CHANNEL PERFORMANCE  
(8.13 mm) .320"  
Optional  
Alignment pin  
RoHS Compliant:  
Yes  
MEC1  
Rating based on Samtec reference channel.  
For full SI performance data visit Samtec.com  
14  
PROCESSING  
or contact SIG@samtec.com  
G
b
p
s
Lead–Free Solderable:  
Yes  
SMT Lead Coplanarity:  
(0.10 mm) .004" max (05-20)  
(0.15 mm) .006" max (30-70)*  
*(.004" stencil solution  
may be available; contact  
IPG@samtec.com)  
PLATING  
OPTION  
OTHER  
OPTION  
POSITIONS  
PER ROW  
1
MEC1  
02  
D
NP  
–A  
RECOGNITIONS  
= Alignment  
Pin metal or  
plastic at  
Samtec  
–F  
–NP  
= No  
Polarization  
(05, 08, 20 &  
30 positions  
only)  
For complete scope of  
recognitions see  
www.samtec.com/quality  
05, 08, 20, 30, 40, 50, 60, 70  
= Gold flash on contact,  
Matte tin on tail  
discretion.  
–L  
FILE NO. E111594  
= 10 µ" (0.25 µm)  
Gold on contact,  
Matte Tin on tail  
–K  
= (7.87 mm)  
.310" DIA  
Polyimide film  
Pick &  
Leave  
Blank for  
polarization  
ALSO AVAILABLE  
(MOQ Required)  
Place Pad  
• Locking Clip  
POLARIZED  
POSITIONS  
(No Contact)  
(Manual placement required)  
POSITIONS  
PER ROW  
(No. of Positions + 2) x  
–TR  
• Other platings  
(1.00) .03937 + (2.54) .100  
= Tape & Reel  
(05-60 only)  
02  
140  
3, 4  
05  
08  
20  
30  
40  
50  
60  
70  
5, 6  
(6.99)  
.275  
15, 16  
21, 22  
(1.83)  
.072  
01  
(0.36)139  
.014  
Important Note:  
31, 32  
(1.00)  
.03937  
Samtec recommends that  
pads on the mating board be  
Gold plated.  
41, 42  
(No. of Positions + 2)  
x (1.00) .03937  
31, 32, 63 & 64  
53, 54, 115 & 116  
Notes:  
(8.89)  
.350  
(9.04)  
.356  
(0.15)  
.006  
(1.40)  
.055  
While optimized for  
50 W applications, this  
connector with alternative  
signal/ground patterns may  
also perform well in certain  
75 W applications.  
(0.89)  
.035  
DIA  
(8.51)  
.335  
–A  
OPTION  
Some sizes, styles and  
options are non-standard,  
non-returnable.  
Due to technical progress, all designs, specifications and components are subject to change without notice.  
WWW.SAMTEC.COM  
All parts within this catalog are built to Samtec’s specifications.  
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.  

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