是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | CHIP | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8533.21.00.30 |
风险等级: | 5.76 | JESD-609代码: | e3 |
安装特点: | SURFACE MOUNT | 端子数量: | 2 |
最低工作温度: | -55 °C | 封装形状: | RECTANGULAR PACKAGE |
包装方法: | TR, PAPER | 额定功率耗散 (P): | 0.063 W |
额定温度: | 70 °C | 电阻: | 9100 Ω |
电阻器类型: | FIXED RESISTOR | 尺寸代码: | 0402 |
子类别: | Fixed Resistors | 表面贴装: | YES |
技术: | METAL GLAZE/THICK FILM | 温度系数: | 200 ppm/ °C |
端子面层: | Tin (Sn) | 端子形状: | WRAPAROUND |
容差: | 1% | 工作电压: | 50 V |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MCR01MZSFW9102 | ROHM |
获取价格 |
RESISTOR, METAL GLAZE/THICK FILM, 0.063W, 1%, 200ppm, 91000ohm, SURFACE MOUNT, 0402, CHIP | |
MCR01MZSJ000 | TAIYO YUDEN |
获取价格 |
Wireless LAN and Bluetooth Module Evaluation Board | |
MCR01MZSJ102 | TAIYO YUDEN |
获取价格 |
Wireless LAN and Bluetooth Module Evaluation Board | |
MCR01MZSJ104 | TAIYO YUDEN |
获取价格 |
Wireless LAN and Bluetooth Module Evaluation Board | |
MCR01MZSJ114 | ROHM |
获取价格 |
Fixed Resistor, Metal Glaze/thick Film, 0.063W, 110000ohm, 50V, 5% +/-Tol, 250ppm/Cel, Sur | |
MCR01MZSJ220 | TAIYO YUDEN |
获取价格 |
Wireless LAN and Bluetooth Module Evaluation Board | |
MCR01MZSJ304 | ROHM |
获取价格 |
Fixed Resistor, Metal Glaze/thick Film, 0.063W, 300000ohm, 50V, 5% +/-Tol, 250ppm/Cel, Sur | |
MCR01MZSJ304 | TAIYO YUDEN |
获取价格 |
Wireless LAN and Bluetooth Module Evaluation Board | |
MCR01MZSJ305 | ROHM |
获取价格 |
Fixed Resistor, Metal Glaze/thick Film, 0.063W, 3000000ohm, 50V, 5% +/-Tol, 250ppm/Cel, Su | |
MCR01MZSJ362 | ROHM |
获取价格 |
Fixed Resistor, Metal Glaze/thick Film, 0.063W, 3600ohm, 50V, 5% +/-Tol, 250ppm/Cel, Surfa |