MCP6491/2/4
7.5 MHz, Low-Input Bias Current Op Amps
Features
Description
• Low-Input Bias Current
- 150 pA (typical, TA = +125°C)
• Low Quiescent Current
- 530 µA/amplifier (typical)
• Low-Input Offset Voltage
- ±1.5 mV (maximum)
The Microchip MCP6491/2/4 family of operational
amplifiers (op amps) has low-input bias current
(150 pA, typical at 125°C) and rail-to-rail input and
output operation. This family is unity gain stable and
has a gain bandwidth product of 7.5 MHz (typical).
These devices operate with a single-supply voltage as
low as 2.4V, while only drawing 530 µA/amplifier
(typical) of quiescent current. These features make the
family of op amps well suited for photodiode amplifier,
pH electrode amplifier, low leakage amplifier, and
battery-powered signal conditioning applications, etc.
• Supply Voltage Range: 2.4V to 5.5V
• Rail-to-Rail Input/Output
• Gain Bandwidth Product: 7.5 MHz (typical)
• Slew Rate: 6 V/µs (typical)
• Unity Gain Stable
The MCP6491/2/4 family is offered in single
(MCP6491), dual (MCP6492), quad (MCP6494)
packages. All devices are designed using an advanced
CMOS process and fully specified in extended
temperature range from -40°C to +125°C.
• No Phase Reversal
• Small Packages
- Singles in SC70-5, SOT-23-5
• Extended Temperature Range
- -40°C to +125°C
Related Parts
• MCP6471/2/4: 2 MHz, Low-Input Bias Current Op
Amps
Applications
• MCP6481/2/4: 4 MHz, Low-Input Bias Current Op
Amps
• Photodiode Amplifier
• pH Electrode Amplifier
• Low Leakage Amplifier
• Piezoelectric Transducer Amplifier
• Active Analog Filter
• Battery-Powered Signal Conditioning
Design Aids
• SPICE Macro Models
• FilterLab® Software
• MAPS (Microchip Advanced Part Selector)
• Analog Demonstration and Evaluation Boards
• Application Notes
Package Types
MCP6492
MCP6494
MCP6492
MCP6491
SOIC, MSOP
SOIC, TSSOP
SC70, SOT-23
2x3 TDFN*
V
1
2
3
5
V
V
OUTA
1
8
V
OUTA
V
1
2
3
4
8 V
V
1
2
3
4
5
14 V
OUTD
OUT
DD
OUTA
DD
DD
V
V
13
–
V
V
–
+
V
–
+
7
SS
2
7 V
IND
OUTB
V
–
+
INA
INA
EP
9
OUTB
INA
4 V
–
V
+
IN
6
+
V
12 V
11 V
10 V
IN
V
–
INB
V
3
4
6
5
V
V
–
V
IND
INA
INA
INB
INA
V
5 V
+
V
DD
V
+
SS
INB
SS
SS
INB
V
+
+
INB
INC
9
8
V
–
VINB
–
6
7
INC
V
V
OUTC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
OUTB
2012-2013 Microchip Technology Inc.
DS20002321C-page 1