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MCP608T-I/P PDF预览

MCP608T-I/P

更新时间: 2024-11-24 04:49:31
品牌 Logo 应用领域
美国微芯 - MICROCHIP 放大器光电二极管
页数 文件大小 规格书
32页 561K
描述
OP-AMP, 250 uV OFFSET-MAX, 0.155 MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8

MCP608T-I/P 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DIP
包装说明:DIP,针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.26
放大器类型:OPERATIONAL AMPLIFIER最大平均偏置电流 (IIB):0.00008 µA
标称共模抑制比:91 dB最大输入失调电压:250 µV
JESD-30 代码:R-PDIP-T8JESD-609代码:e3
长度:9.46 mm功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:4.32 mm
标称压摆率:0.08 V/us子类别:Operational Amplifier
供电电压上限:7 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
标称均一增益带宽:155 kHz宽度:7.62 mm

MCP608T-I/P 数据手册

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MCP606/7/8/9  
2.5V to 6.0V Micropower CMOS Op Amp  
Description  
Features  
The MCP606/7/8/9 family of operational amplifiers (op  
amps) from Microchip Technology Inc. are unity-gain  
stable with low offset voltage (250 µV, maximum).  
Performance characteristics include rail-to-rail output  
swing capability and low input bias current (80 pA at  
+85°C, maximum). These features make this family of  
op amps well suited for single-supply, precision,  
high-impedance, battery-powered applications.  
• Low Input Offset Voltage: 250 µV (maximum)  
• Rail-to-Rail Output  
• Low Input Bias Current: 80 pA (maximum at  
+85°C)  
• Low Quiescent Current: 25 µA (maximum)  
• Power Supply Voltage: 2.5V to 6.0V  
• Unity-Gain Stable  
• Chip Select (CS) Capability: MCP608  
• Industrial Temperature Range: -40°C to +85°C  
• No Phase Reversal  
The single is available in standard 8-lead PDIP, SOIC  
and TSSOP packages, as well as in a SOT-23-5  
package. The single MCP608 with Chip Select (CS) is  
offered in the standard 8-lead PDIP, SOIC and TSSOP  
packages. The dual MCP607 is offered in the standard  
8-lead PDIP, SOIC and TSSOP packages. Finally, the  
quad MCP609 is offered in the standard 14-lead PDIP,  
SOIC and TSSOP packages. All devices are fully  
specified from -40°C to +85°C, with power supplies  
from 2.5V to 6.0V.  
• Available in Single, Dual and Quad Packages  
Typical Applications  
• Battery Power Instruments  
• High-Impedance Applications  
• Strain Gauges  
• Medical Instruments  
Test Equipment  
Package Types  
MCP606  
PDIP, SOIC,TSSOP  
MCP606  
SOT-23-5  
Design Aids  
NC 1  
8
7
6
VOUT  
VSS  
VIN+  
1
5
4
NC  
VDD  
• SPICE Macro Models  
• FilterLab® Software  
2
3
4
2
3
VIN–  
VIN+  
VSS  
VDD  
VOUT  
VIN–  
• Mindi™ Circuit Designer & Simulator  
• Analog Demonstration and Evaluation Boards  
• Application Notes  
5 NC  
MCP607  
PDIP, SOIC,TSSOP  
MCP608  
PDIP, SOIC,TSSOP  
Typical Application  
VOUTA  
1
2
3
4
8
7
6
NC 1  
8
7
6
VDD  
CS  
2
3
4
VINA  
VINA  
+
VOUTB VIN–  
VDD  
VOUT  
VOUT = VLM + I R  
(R RG)  
F
L
SEN  
IL  
VINB  
+
VIN+  
VSS  
5 VINB  
5 NC  
VSS  
RF  
RG  
To Load  
(VLP  
)
50 kΩ  
MCP609  
PDIP, SOIC,TSSOP  
5 kΩ  
2.5V  
to  
6.0V  
VOUTA  
1
2
3
4
5
6
7
14  
13  
12  
VOUTD  
VOUT  
VINA  
VINA  
+
VIND  
VIND  
+
MCP606  
RSEN  
10Ω  
To Load  
11 VSS  
10  
9
(VLM  
)
VDD  
VINB  
VINB  
+
VINC  
VINC  
+
Low-Side Battery Current Sensor  
8 VOUTC  
VOUTB  
© 2008 Microchip Technology Inc.  
DS11177E-page 1  

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