是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | HVSON, | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 13 weeks |
风险等级: | 1.09 | JESD-30 代码: | S-PDSO-N8 |
JESD-609代码: | e3 | 长度: | 3 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVSON | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
座面最大高度: | 1 mm | 标称供电电压: | 5 V |
表面贴装: | YES | 电信集成电路类型: | SUPPORT CIRCUIT |
温度等级: | AUTOMOTIVE | 端子面层: | Matte Tin (Sn) - annealed |
端子形式: | NO LEAD | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MCP2562T-E/SN | MICROCHIP |
完全替代 |
DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MCP2562T-E/SN | MICROCHIP |
获取价格 |
DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT | |
MCP-26-I9-LL | YAMAICHI |
获取价格 |
MatchCon | |
MCP-26-TI9-LL | YAMAICHI |
获取价格 |
MatchCon | |
MCP2SS | YAGEO |
获取价格 |
Fixed Resistor, Carbon Film, 350V, Surface Mount, 3313, MELF | |
MCP3001 | MICROCHIP |
获取价格 |
2.7V 10 BIT A/D CONVERTER WITH SPI SERIAL INTERFACE | |
MCP3001_07 | MICROCHIP |
获取价格 |
2.7V 10 BIT A/D CONVERTER WITH SPI SERIAL INTERFACE | |
MCP3001-I/MS | MICROCHIP |
获取价格 |
2.7V 10 BIT A/D CONVERTER WITH SPI SERIAL INTERFACE | |
MCP3001-I/P | MICROCHIP |
获取价格 |
2.7V 10 BIT A/D CONVERTER WITH SPI SERIAL INTERFACE | |
MCP3001-I/SN | MICROCHIP |
获取价格 |
2.7V 10 BIT A/D CONVERTER WITH SPI SERIAL INTERFACE | |
MCP3001-I/ST | MICROCHIP |
获取价格 |
2.7V 10 BIT A/D CONVERTER WITH SPI SERIAL INTERFACE |