5秒后页面跳转
MCM64Z836TQ8.5R PDF预览

MCM64Z836TQ8.5R

更新时间: 2024-11-21 20:18:59
品牌 Logo 应用领域
恩智浦 - NXP 静态存储器内存集成电路
页数 文件大小 规格书
34页 740K
描述
256KX36 ZBT SRAM, 8.5ns, PQFP100, PLASTIC, TQFP-100

MCM64Z836TQ8.5R 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Transferred零件包装代码:QFP
包装说明:PLASTIC, TQFP-100针数:100
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.53
Is Samacsys:N最长访问时间:8.5 ns
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
长度:20 mm内存密度:9437184 bit
内存集成电路类型:ZBT SRAM内存宽度:36
湿度敏感等级:1功能数量:1
端子数量:100字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:256KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:SERIAL
峰值回流温度(摄氏度):225电源:2.5 V
认证状态:Not Qualified座面最大高度:1.6 mm
最大待机电流:0.01 A最小待机电流:2.3 V
子类别:SRAMs最大压摆率:0.25 mA
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

MCM64Z836TQ8.5R 数据手册

 浏览型号MCM64Z836TQ8.5R的Datasheet PDF文件第2页浏览型号MCM64Z836TQ8.5R的Datasheet PDF文件第3页浏览型号MCM64Z836TQ8.5R的Datasheet PDF文件第4页浏览型号MCM64Z836TQ8.5R的Datasheet PDF文件第5页浏览型号MCM64Z836TQ8.5R的Datasheet PDF文件第6页浏览型号MCM64Z836TQ8.5R的Datasheet PDF文件第7页 
Freescale Semiconductor, Inc.  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MCM64Z836/D  
MCM64Z836  
MCM64Z918  
Product Preview  
256K x 36 and 512K x 18 Bit  
ZBT Fast Static RAM  
The ZBT RAM is an 8M–bit synchronous fast static RAM designed to provide  
Zero Bus Turnaround . The ZBT RAM allows 100% use of bus cycles during  
back–to–back read/write and write/read cycles. The MCM64Z836 (organized as  
256K words by 36 bits) and the MCM64Z918 (organized as 512K words by 18  
bits) are fabricated in Motorola’s high performance silicon gate CMOS tech-  
nology. This device integrates input registers, an output register, a 2–bit address  
counter, and high speed SRAM onto a single monolithic circuit for reduced parts  
count in communication applications. Synchronous design allows precise cycle  
control with the use of an external positive–edge–triggered clock (CK). CMOS  
circuitry reduces the overall power consumption of the integrated functions for  
greater reliability.  
TQ PACKAGE  
TQFP  
CASE 983A–01  
ZP PACKAGE  
PBGA  
CASE 999–02  
Addresses (SA), data inputs (DQ), and all control signals except output enable  
(G) and linear burst order (LBO) are clock (CK) controlled through positive–  
edge–triggered noninverting registers.  
Write cycles are internally self–timed and are initiated by the rising edge of the  
clock (CK) input. This feature eliminates complex off–chip write pulse generation  
and provides increased timing flexibility for incoming signals. Write data is  
supplied to the memory one cycle after the write sequence initiation for the flow–  
throughdevice, andtwocyclesafterthewritesequenceinitiationforthepipelined  
device.  
For flow–through read cycles, the SRAM allows output data to simply flow freely from the memory  
array. For pipelined read cycles, the SRAM output data is temporarily stored by an edge–triggered  
output register and then released to the output buffers at the next rising edge of clock (CK).  
The MCM64Z836 and MCM64Z918 operate from a 2.5 V core power supply and all outputs oper-  
ate on a 2.5 V power supply. All inputs and outputs are JEDEC Standard JESD8–5 compatible.  
2.5 V ±200 mV Core Power Supply, 2.5 V I/O Supply  
MCM64Z836/918–7 = 7 ns Flow–Through Access/2.6 ns Pipelined Access (225 MHz)  
MCM64Z836/918–8 = 8 ns Flow–Through Access/3 ns Pipelined Access (200 MHz)  
MCM64Z836/918–8.5 = 8.5 ns Flow–Through Access/3.5 ns Pipelined Access (166 MHz)  
Selectable Read/Write Functionality (Flow–Through/Pipelined)  
Selectable Burst Sequencing Order (Linear/Interleaved)  
Internally Self–Timed Write Cycle  
Two–Cycle Deselect (Pipelined)  
Byte Write Control  
ADV Controlled Burst  
Simplified JTAG  
100–Pin TQFP and 119–Bump PBGA Packages  
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by  
Micron Technology, Inc. and Motorola, Inc.  
This document contains information on a new product under development. Motorola reserves the right to change or discontinue this product without notice.  
REV 3  
9/1/99  
Motorola, Inc. 1999  
For More Information On This Product,  
Go to: www.freescale.com  

与MCM64Z836TQ8.5R相关器件

型号 品牌 获取价格 描述 数据表
MCM64Z836TQ8R NXP

获取价格

256KX36 ZBT SRAM, 8ns, PQFP100, PLASTIC, TQFP-100
MCM64Z836TQ8R FREESCALE

获取价格

256K x 36 and 512K x 18 Bit ZBT Fast Static RAM
MCM64Z836ZP166 MOTOROLA

获取价格

ZBT SRAM, 256KX36, 3.6ns, CMOS, PBGA119, PLASTIC, BGA-119
MCM64Z836ZP166R MOTOROLA

获取价格

ZBT SRAM, 256KX36, 3.6ns, CMOS, PBGA119, PLASTIC, BGA-119
MCM64Z836ZP7 NXP

获取价格

256KX36 ZBT SRAM, 7ns, PBGA119, BUMP, PLASTIC, BGA-119
MCM64Z836ZP7 FREESCALE

获取价格

256K x 36 and 512K x 18 Bit ZBT Fast Static RAM
MCM64Z836ZP7R FREESCALE

获取价格

256K x 36 and 512K x 18 Bit ZBT Fast Static RAM
MCM64Z836ZP7R NXP

获取价格

256KX36 ZBT SRAM, 7ns, PBGA119, BUMP, PLASTIC, BGA-119
MCM64Z836ZP8 FREESCALE

获取价格

256K x 36 and 512K x 18 Bit ZBT Fast Static RAM
MCM64Z836ZP8 NXP

获取价格

256KX36 ZBT SRAM, 8ns, PBGA119, BUMP, PLASTIC, BGA-119