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MCM64T116DG70 PDF预览

MCM64T116DG70

更新时间: 2024-11-18 20:50:43
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
16页 377K
描述
Fast Page DRAM Module, 1MX64, 70ns, CMOS, DIMM-168

MCM64T116DG70 技术参数

生命周期:Obsolete零件包装代码:DIMM
包装说明:DIMM, DIMM168针数:168
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.84
访问模式:FAST PAGE最长访问时间:70 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH备用内存宽度:32
I/O 类型:COMMONJESD-30 代码:R-XDMA-N168
内存密度:67108864 bit内存集成电路类型:FAST PAGE DRAM MODULE
内存宽度:64功能数量:1
端口数量:1端子数量:168
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX64
输出特性:3-STATE封装主体材料:UNSPECIFIED
封装代码:DIMM封装等效代码:DIMM168
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
电源:5 V认证状态:Not Qualified
刷新周期:1024座面最大高度:31.877 mm
自我刷新:NO最大待机电流:0.076 A
子类别:DRAMs最大压摆率:0.7 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

MCM64T116DG70 数据手册

 浏览型号MCM64T116DG70的Datasheet PDF文件第2页浏览型号MCM64T116DG70的Datasheet PDF文件第3页浏览型号MCM64T116DG70的Datasheet PDF文件第4页浏览型号MCM64T116DG70的Datasheet PDF文件第5页浏览型号MCM64T116DG70的Datasheet PDF文件第6页浏览型号MCM64T116DG70的Datasheet PDF文件第7页 
Order this document  
by MCM64T116/D  
SEMICONDUCTOR  
TECHNICAL DATA  
MCM64T116  
Product Preview  
1M x 64 Bit Dynamic Random  
Access Memory Module  
D PACKAGE  
DIMM MODULE  
CASE 1115B–01  
The MCM64T116 is a dynamic random access memory (DRAM) module  
organized as 1,048,576 x 64 bits. The module is a JEDEC–standard 168–lead  
dual–in–line memory module (DIMM) with 84 separate contacts per side, consisting  
of four MCM518160A DRAMs housed in standard 400–mil packages (TSOP),  
mounted on a substrate along with two 0.22 µF (min) decoupling capacitors  
mounted adjacent to each DRAM. Buffering is provided for address and all clock  
pins except RAS. The MCM518160A is a CMOS high speed dynamic random  
access memory organized as 1,048,576 sixteen–bit words and fabricated with  
CMOS silicon–gate process technology.  
1
10  
11  
Three–State Data Output  
Early–Write Common I/O Capability  
Fast Page Mode Capability  
TTL–Compatible Inputs and Outputs  
RAS–Only Refresh  
CAS Before RAS Refresh  
Hidden Refresh  
1024 Cycle Refresh: 16 ms (Max)  
Consists of Four 1M x 16 DRAMs, Eight 0.22 µF (Min) Decoupling Capacitors,  
and Two 16–Bit Buffers  
40  
41  
Unlatched Data Out at Cycle End Allows Two Dimensional Chip Selection  
Presence Detect Enable (PDE) Controls Access to 8 Bits of Buffered PD  
Information  
Notch Keys Prevent Accidental Insertion in Low Voltage (3.3 V) Systems  
Fast Access Time (t  
RAC  
): MCM64T116–60 = 60 ns (Max)  
MCM64T116–70 = 70 ns (Max)  
Low Active Power Dissipation: MCM64T116–60 = 828 mW (Max)  
MCM64T116–70 = 700 mW (Max)  
Low Standby Power Dissipation: TTL Levels = 80 mW (Max)  
CMOS Levels = 76 mW (Max)  
84  
PIN NAMES  
A0, B0, A1 – A9 . . . . . . . . . Address Inputs  
CAS0 – CAS7 . . Column Address Strobe  
WE0, WE2 . . . . . . . . . . . . . . . Write Enable  
PD1 – PD8 . . . Buffered Presence Detect  
PDE . . . . Presence Detect Output Enable  
DQ0 – DQ70* . . . . . Data Input/Output  
RAS0, RAS2 . . . Row Address Strobe  
G0, G2 . . . . . . . . . . . . . . Output Enable  
ID0, ID1 . . . . . . . . . . Unbuffered ID Bit  
V
. . . . . . . . . . . . . . . . Power (+ 5 V)  
CC  
NC . . . . . . . . . . . . . . . . No Connection  
V
SS  
. . . . . . . . . . . . . . . . . . . . . . . . . Ground  
*DQ8, DQ17, DQ26, DQ35, DQ44, DQ53, andDQ62arenotpresenton64bitmodules.  
This document contains information on a new product under development. Motorola reserves the right to change or discontinue this product without notice.  
10/95  
Motorola, Inc. 1995  

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