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MCBOE32GQMPQ-MWA

更新时间： 2024-11-27 20:55:43

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MCBOE32GQMPQ-MWA 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	零件包装代码：	BGA
包装说明：	BGA,	Reach Compliance Code：	compliant
风险等级：	5.84	外部数据总线宽度：	16
主机接口标准：	ATA	JESD-30 代码：	X-PBGA-B
湿度敏感等级：	3	最高工作温度：	85 °C
最低工作温度：	-25 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装形状：	UNSPECIFIED
封装形式：	GRID ARRAY	峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified	最大供电电压：	3.6 V
最小供电电压：	3 V	标称供电电压：	3.3 V
表面贴装：	YES	技术：	CMOS
温度等级：	COMMERCIAL EXTENDED	端子形式：	BALL
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	NOT SPECIFIED
uPs/uCs/外围集成电路类型：	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	Base Number Matches：	1

NAND Flash-based Solid State Disk

N S S D

(NAND Flash-based Solid State Disk)

Module Type

Product Data sheet

Version 1.1

Sep 2006

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.

ALL INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or sim-

ilar applications where Product failure could result in loss of life or personal or physical harm, or any military

or defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

Sep. 27. 2006

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