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MC9S12T64MPK16 PDF预览

MC9S12T64MPK16

更新时间: 2024-11-13 20:41:15
品牌 Logo 应用领域
恩智浦 - NXP 时钟外围集成电路
页数 文件大小 规格书
2页 223K
描述
IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC

MC9S12T64MPK16 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:QFP包装说明:LFQFP, QFP80,.55SQ,20
针数:80Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.31.00.01
风险等级:5.24Is Samacsys:N
具有ADC:YES地址总线宽度:16
位大小:16CPU系列:CPU12
最大时钟频率:16 MHzDAC 通道:NO
DMA 通道:NO外部数据总线宽度:16
JESD-30 代码:S-PQFP-G80JESD-609代码:e0
长度:12 mm湿度敏感等级:2
I/O 线路数量:56端子数量:80
最高工作温度:125 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LFQFP封装等效代码:QFP80,.55SQ,20
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):220电源:2.5,5 V
认证状态:Not QualifiedRAM(字节):2048
ROM(单词):32768ROM可编程性:FLASH
座面最大高度:1.7 mm速度:32 MHz
子类别:Microcontrollers最大供电电压:2.75 V
最小供电电压:2.25 V标称供电电压:2.5 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:12 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

MC9S12T64MPK16 数据手册

 浏览型号MC9S12T64MPK16的Datasheet PDF文件第2页 
Freescale Semiconductor, Inc.  
7/9/2003  
V0.2  
HCS12 Document Methodology  
Document Types  
The HCS12 Family document set is designed to give the customer the most up-to-date,  
comprehensive information in an efficient manner. The device documentation is broken down  
into two types:  
Device Guides — Listed under the data sheet category. These provide device-specific  
information, such as which modules are incorporated in a device and how those modules  
interact. There is a document reference table near the beginning of each device guide. It  
indicates which version of each block guide should be consulted for all modules on chip.  
Examples of information contained in the device guides are:  
— Module list (reference to applicable block guides)  
— Pin assignments  
— Top-level block diagram  
— Top-level memory map  
— Interrupt vectors  
— Electrical specifications  
— Package mechanical information  
Block Guides — Listed under the reference manual category. These provide detailed module-  
specific information. They contain:  
— Module register map  
— Module functional description  
The document set for each device may be downloaded individually or as a collection contained in  
a single zip file.  
Revision Numbering  
Understanding the way the HCS12 Family documents are versioned is vital to understanding  
organization of the literature. There are two revision levels on each document:  
Major — V04.11 (The four in this example is the major revision number.) When a document  
is changed to reflect a functional change in the way a device operates, from one version of  
silicon to another or from one version of a module to another, the functional change will be  
described in a document that increments the major revision number. This major version  
number is included in the order number of the document, for example S12CRGV4/D, where  
S12CRGV3/D documents an earlier version of the CRG module still included on some  
devices. The specification for the CRG module changed between V3 and V4 of the block  
guide.  
Minor — V04.11 (The eleven in this example is the minor revision number.) Minor revisions  
indicate that typos were fixed, or other minor corrections were made to the document. Minor  
revisions do not indicate a functional change.  
On the Web display, the document number will show as S12CRGV4/D, Rev. 11, because V4.11 is  
the eleventh revision of major version 4 of the document.  
When consulting documentation for the HCS12 Family devices, be aware that the date on the  
cover of the document indicates the date the document was released to publication. The date  
displayed on the Web is the day the document appeared on the Web. The two dates may not  
match. The important thing to look at is the major.minor revision number, and not the date.  
Detailed revision history tables within each of the documents describe what changes were made,  
and when.  
For More Information On This Product,  
Go to: www.freescale.com  

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