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MC68MH360FE25V PDF预览

MC68MH360FE25V

更新时间: 2024-02-07 18:56:43
品牌 Logo 应用领域
恩智浦 - NXP 时钟外围集成电路
页数 文件大小 规格书
962页 7612K
描述
RISC MICROCONTROLLER, CQFP240, CERAMIC, QFP-240

MC68MH360FE25V 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:CERAMIC, QFP-240针数:240
Reach Compliance Code:unknown风险等级:5.71
Is Samacsys:N具有ADC:NO
地址总线宽度:32位大小:32
最大时钟频率:25 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:32
JESD-30 代码:S-CQFP-G240长度:31.305 mm
I/O 线路数量:46端子数量:240
最高工作温度:70 °C最低工作温度:
PWM 通道:NO封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:FQFP封装等效代码:QFP240,1.3SQ,20
封装形状:SQUARE封装形式:FLATPACK, FINE PITCH
电源:3.3 V认证状态:Not Qualified
ROM可编程性:FLASH座面最大高度:4.15 mm
速度:25 MHz子类别:Other Microprocessor ICs
最大压摆率:327 mA最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
宽度:31.305 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

MC68MH360FE25V 数据手册

 浏览型号MC68MH360FE25V的Datasheet PDF文件第1页浏览型号MC68MH360FE25V的Datasheet PDF文件第2页浏览型号MC68MH360FE25V的Datasheet PDF文件第3页浏览型号MC68MH360FE25V的Datasheet PDF文件第5页浏览型号MC68MH360FE25V的Datasheet PDF文件第6页浏览型号MC68MH360FE25V的Datasheet PDF文件第7页 
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