是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | 1.27 MM PITCH, PLASTIC, BGA-357 |
针数: | 357 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.A.2 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.74 | 地址总线宽度: | 32 |
边界扫描: | YES | 总线兼容性: | MC68040; MC68030 |
最大时钟频率: | 25 MHz | 通信协议: | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP |
数据编码/解码方法: | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 最大数据传输速率: | 1.25 MBps |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B357 |
JESD-609代码: | e1 | 长度: | 25 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 357 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 260 |
座面最大高度: | 1.86 mm | 最大供电电压: | 5.25 V |
最小供电电压: | 4.75 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MC68MH360ZP25L | MOTOROLA | LAN Controller, 4 Channel(s), 1.25MBps, HCMOS, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC |
获取价格 |
|
MC68MH360ZP25LR2 | MOTOROLA | LAN Controller, 4 Channel(s), 1.25MBps, HCMOS, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC |
获取价格 |
|
MC68MH360ZP25VL | MOTOROLA | 4 CHANNEL(S), 10Mbps, LOCAL AREA NETWORK CONTROLLER, PBGA357, 25 X 25 MM, 1.27 MM PITCH, P |
获取价格 |
|
MC68MH360ZP33L | MOTOROLA | LAN Controller, 4 Channel(s), 1.25MBps, HCMOS, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC |
获取价格 |
|
MC68MH360ZP33LR2 | MOTOROLA | 4 CHANNEL(S), 10Mbps, LOCAL AREA NETWORK CONTROLLER, PBGA357, 25 X 25 MM, 1.27 MM PITCH, P |
获取价格 |
|
MC68MH360ZQ25VL | NXP | QUICC, 2SMC, 1SPI |
获取价格 |