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MC68MH360VR33L PDF预览

MC68MH360VR33L

更新时间： 2024-02-01 11:04:16
品牌 Logo 应用领域
恩智浦 - NXP 通信时钟以太网：16GBASE-T数据传输外围集成电路
页数 文件大小 规格书
158页 1507K
描述
10Mbps, SERIAL COMM CONTROLLER, PBGA357, 1.27 MM PITCH, PLASTIC, BGA-357

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MC68MH360VR33L 技术参数

是否Rohs认证： 符合生命周期：Transferred
零件包装代码：BGA包装说明：1.27 MM PITCH, PLASTIC, BGA-357
针数：357Reach Compliance Code：compliant
ECCN代码：3A991.A.2HTS代码：8542.31.00.01
风险等级：5.74地址总线宽度：32
边界扫描：YES总线兼容性：MC68040; MC68030
最大时钟频率：25 MHz通信协议：BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP
数据编码/解码方法：NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL最大数据传输速率：1.25 MBps
外部数据总线宽度：32JESD-30 代码：S-PBGA-B357
JESD-609代码：e1长度：25 mm
低功率模式：YES湿度敏感等级：3
端子数量：357最高工作温度：70 °C
最低工作温度：封装主体材料：PLASTIC/EPOXY
封装代码：BGA封装形状：SQUARE
封装形式：GRID ARRAY峰值回流温度（摄氏度）：260
座面最大高度：1.86 mm最大供电电压：5.25 V
最小供电电压：4.75 V标称供电电压：5 V
表面贴装：YES技术：CMOS
温度等级：COMMERCIAL端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：1.27 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：40
宽度：25 mmuPs/uCs/外围集成电路类型：SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches：1

MC68MH360VR33L 数据手册

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与MC68MH360VR33L相关器件

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MC68MH360ZP25LR2 MOTOROLA

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 		LAN Controller, 4 Channel(s), 1.25MBps, HCMOS, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC
MC68MH360ZP25VL MOTOROLA

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 		4 CHANNEL(S), 10Mbps, LOCAL AREA NETWORK CONTROLLER, PBGA357, 25 X 25 MM, 1.27 MM PITCH, P
MC68MH360ZP33L MOTOROLA

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 		LAN Controller, 4 Channel(s), 1.25MBps, HCMOS, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC
MC68MH360ZP33LR2 MOTOROLA

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 		4 CHANNEL(S), 10Mbps, LOCAL AREA NETWORK CONTROLLER, PBGA357, 25 X 25 MM, 1.27 MM PITCH, P
MC68MH360ZQ25VL NXP

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 		QUICC, 2SMC, 1SPI
MC68MH360ZQ33L NXP

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 		QUICC, 2SMC, 1SPI
MC68P11E1CFN2R2 ROCHESTER

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 		8-BIT, 2MHz, MICROCONTROLLER, PQCC52, PLASTIC, QCC-52
MC68PM302 MOTOROLA

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 		Integrated Multiprotocol Processor with PCMCIA
MC68PM302CPV20B MOTOROLA

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