是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | LCC | 包装说明: | QCCJ, LDCC68,1.0SQ |
针数: | 68 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.41 | 地址总线宽度: | 23 |
位大小: | 32 | 边界扫描: | NO |
最大时钟频率: | 16.67 MHz | 外部数据总线宽度: | 16 |
格式: | FIXED POINT | 集成缓存: | NO |
JESD-30 代码: | S-PQCC-J68 | JESD-609代码: | e0 |
长度: | 24.2062 mm | 低功率模式: | NO |
湿度敏感等级: | 3 | 端子数量: | 68 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | QCCJ |
封装等效代码: | LDCC68,1.0SQ | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER | 峰值回流温度(摄氏度): | 220 |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 4.57 mm | 速度: | 16.67 MHz |
子类别: | Microprocessors | 最大压摆率: | 50 mA |
最大供电电压: | 5.25 V | 最小供电电压: | 4.75 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | J BEND |
端子节距: | 1.27 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 24.2062 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MC68HC000FN20 | MOTOROLA |
获取价格 |
Addendum to M68000 User Manual | |
MC68HC000FN20R2 | MOTOROLA |
获取价格 |
32-BIT, 20MHz, MICROPROCESSOR, PQCC68, PLASTIC, LCC-68 | |
MC68HC000FN8 | MOTOROLA |
获取价格 |
Addendum to M68000 User Manual | |
MC68HC000FN8R2 | MOTOROLA |
获取价格 |
32-BIT, 8MHz, MICROPROCESSOR, PQCC68, PLASTIC, LCC-68 | |
MC68HC000IRC12F | MOTOROLA |
获取价格 |
32-BIT, 16.67MHz, MICROPROCESSOR, CPGA68, CERAMIC, PGA-68 | |
MC68HC000L10 | MOTOROLA |
获取价格 |
16-BIT, 10MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64 | |
MC68HC000L12 | MOTOROLA |
获取价格 |
Microprocessor, 16-Bit, 12.5MHz, CMOS, CDIP64, CERAMIC, DIP-64 | |
MC68HC000L12F | MOTOROLA |
获取价格 |
16-BIT, 16.67MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64 | |
MC68HC000L16 | MOTOROLA |
获取价格 |
16-BIT, 16.67MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64 | |
MC68HC000L8 | MOTOROLA |
获取价格 |
16-BIT, 8 MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64 |