生命周期: | Transferred | 零件包装代码: | DIP |
包装说明: | DIP, DIP14,.3 | 针数: | 14 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.19 | 模拟集成电路 - 其他类型: | SPST |
JESD-30 代码: | R-PDIP-T14 | JESD-609代码: | e0 |
长度: | 18.86 mm | 标称负供电电压 (Vsup): | |
正常位置: | NO | 信道数量: | 1 |
功能数量: | 4 | 端子数量: | 14 |
标称断态隔离度: | 50 dB | 通态电阻匹配规范: | 10 Ω |
最大通态电阻 (Ron): | 280 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 输出: | SEPARATE OUTPUT |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装等效代码: | DIP14,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 电源: | 5/15 V |
认证状态: | Not Qualified | 座面最大高度: | 4.69 mm |
子类别: | Multiplexer or Switches | 最大供电电流 (Isup): | 0.03 mA |
标称供电电压 (Vsup): | 15 V | 表面贴装: | NO |
最长断开时间: | 60 ns | 最长接通时间: | 30 ns |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
宽度: | 7.62 mm | Base Number Matches: | 1 |
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