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MC10H211_06 PDF预览

MC10H211_06

更新时间: 2024-11-04 04:59:39
品牌 Logo 应用领域
安森美 - ONSEMI
页数 文件大小 规格书
6页 128K
描述
Dual 3−Input 3−Output NOR Gate

MC10H211_06 数据手册

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MC10H211  
Dual 3−Input 3−Output NOR  
Gate  
Description  
The MC10H211 is designed to drive up to six transmission lines  
simultaneously. The multiple outputs of this device also allow the wire  
ORing of several levels of gating for minimization of gate and package  
count.  
The ability to control three parallel lines with minimum propagation  
delay from a single point makes the MC10H211 particularly useful in  
clock distribution applications where minimum clock skew is desired.  
http://onsemi.com  
MARKING DIAGRAMS*  
16  
1
Features  
Propagation Delay, 1.0 ns Typical  
Power Dissipation, 160 mW Typical  
Improved Noise Margin 150 mV  
(Over Operating Voltage and Temperature Range)  
Voltage Compensated  
MC10H211L  
AWLYYWW  
CDIP16  
L SUFFIX  
CASE 620A  
16  
1
MECL 10KCompatible  
PbFree Packages are Available*  
MC10H211P  
AWLYYWWG  
16  
1
2
3
4
PDIP16  
P SUFFIX  
CASE 648  
5
6
7
12  
13  
14  
10H211  
ALYWG  
9
10  
11  
V
V
V
= PINS 1, 15  
= PIN 16  
CC1  
CC2  
SOEIAJ16  
CASE 966  
= PIN 8  
EE  
Figure 1. Logic Diagram  
1 20  
V
A
V
V
B
B
B
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
CC1  
CC2  
CC1  
OUT  
OUT  
OUT  
10H211G  
AWLYYWW  
20  
OUT  
OUT  
OUT  
1
A
A
PLLC20  
FN SUFFIX  
CASE 775  
A
IN  
A
B
B
B
IN  
IN  
IN  
IN  
A
= Assembly Location  
= Year  
A
IN  
WL, L = Wafer Lot  
YY, Y  
V
EE  
WW, W = Work Week  
= PbFree Package  
G
Pin assignment is for DualinLine Package.  
For PLCC pin assignment, see the Pin Conversion Tables on page 18  
of the ON Semiconductor MECL Data Book (DL122/D).  
Figure 2. Dip Pin Assignment  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2006 Rev. 9  
MC10H211/D  

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