Datasheet > MBRS230LT3_05

MBRS230LT3_05

更新时间： 2024-01-04 12:41:31

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
4页	50K
描述
Surface Mount Schottky Power Rectifier

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中文翻译

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数据手册

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MBRS230LT3_05 数据手册

MBRS230LT3

Surface Mount

Schottky Power Rectifier

SMB Power Surface Mount Package

This device employs the Schottky Barrier principle in a

metal−to−siliconpower rectifier. Features epitaxial construction with

oxide passivation and metal overlay contact. Ideally suited for low

voltage, high frequency switching power supplies; free wheeling

diodes and polarity protection diodes.

http://onsemi.com

SCHOTTKY BARRIER

RECTIFIER

2.0 AMPERES

30 VOLTS

Features

• Compact Package with J−Bend Leads Ideal for Automated Handling

• Highly Stable Oxide Passivated Junction

• Guardring for Over−Voltage Protection

• Low Forward Voltage Drop

SMB

CASE 403A

PLASTIC

• Pb−Free Package is Available

Mechanical Characteristics

• Case: Molded Epoxy

• Epoxy Meets UL 94, V−0 @ 0.125 in.

• Weight: 95 mg (approximately)

MARKING DIAGRAM

• Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

• Maximum Temperature of 260°C/10 Seconds for Soldering

• Available in 12 mm Tape, 2500 Units per 13″ Reel,

Add “T3” Suffix to Part Number

ALYW

2BL3G

• Cathode Polarity Band

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

†

Device

Package

Shipping

MBRS230LT3

MBRS230LT3G

SMB

2500/Tape & Reel

SMB

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2005

Publication Order Number:

April, 2005 − Rev. 3

MBRS230LT3/D

12 3 4

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