MBRS1100T3, MBRS190T3
Preferred Devices
Schottky Power Rectifier
Surface Mount Power Package
Schottky Power Rectifiers employ the use of the Schottky Barrier
principle in a large area metal-to-silicon power diode. State-of-the-art
geometry features epitaxial construction with oxide passivation and
metal overlay contact. Ideally suited for low voltage, high frequency
rectification, or as free wheeling and polarity protection diodes, in
surface mount applications where compact size and weight are critical
to the system. These state-of-the-art devices have the following
features:
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE
90, 100 VOLTS
Features
• Pb−Free Packages are Available
• Small Compact Surface Mountable Package with J-Bend Leads
• Rectangular Package for Automated Handling
• Highly Stable Oxide Passivated Junction
• High Blocking Voltage − 100 Volts
SMB
CASE 403A
PLASTIC
• 175°C Operating Junction Temperature
• Guardring for Stress Protection
MARKING DIAGRAM
Mechanical Characteristics
• Case: Epoxy, Molded
AYW
B1xG
• Weight: 95 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
B1 = Device Code
x
= C for MBRS1100T3
9 for MBRS190T3
= Assembly Location
= Year
= Work Week
= Pb−Free Package
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
A
Y
W
G
• Shipped in 12 mm Tape and Reel, 2500 units per reel
• Cathode Polarity Band
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage MBRS190T3
MBRS1100T3
V
V
RRM
V
RWM
V
90
100
R
Preferred devices are recommended choices for future use
and best overall value.
Average Rectified Forward Current
I
A
A
F(AV)
T = 163°C
T = 148°C
L
1.0
2.0
L
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
50
FSM
Operating Junction Temperature (Note 1)
Voltage Rate of Change
T
−65 to +175
10
°C
J
dv/dt
V/ns
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dP /dT < 1/R .
q
JA
D
J
©
Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
March, 2007 − Rev. 9
MBRS1100T3/D