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MBRP20060CTG PDF预览

MBRP20060CTG

更新时间: 2024-11-23 04:16:39
品牌 Logo 应用领域
安森美 - ONSEMI 开关
页数 文件大小 规格书
6页 174K
描述
POWERTAP II SWITCHMODE Power Rectifier

MBRP20060CTG 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, PLASTIC, CASE 357C-03, POWERTAP II, 2 PIN针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.76
应用:POWER外壳连接:CATHODE
配置:COMMON CATHODE, 2 ELEMENTS二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE最大正向电压 (VF):0.91 V
JESD-30 代码:R-PUFM-X2最大非重复峰值正向电流:1500 A
元件数量:2相数:1
端子数量:2最高工作温度:150 °C
最大输出电流:100 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):260认证状态:Not Qualified
最大重复峰值反向电压:60 V子类别:Rectifier Diodes
表面贴装:NO技术:SCHOTTKY
端子面层:Nickel (Ni)端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:40
Base Number Matches:1

MBRP20060CTG 数据手册

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MBRP20060CT  
Preferred Device  
POWERTAPt II  
SWITCHMODEt  
Power Rectifier  
These stateoftheart devices use the Schottky Barrier principle  
with a platinum barrier metal.  
http://onsemi.com  
Features  
SCHOTTKY  
BARRIER RECTIFIER  
200 AMPERES, 60 VOLTS  
Dual Diode Construction May Be Paralleled for Higher Current  
Output  
Guardring for Stress Protection  
Low Forward Voltage  
150°C Operating Junction Temperature  
PbFree Package is Available*  
1
3
2
Mechanical Characteristics:  
Case: Epoxy, Molded with metal heatsink base  
Weight: 80 Grams (Approximately)  
Finish: All External Surfaces Corrosion Resistant  
Top Terminal Torque: 2540 lbin max  
Base Plate Torques: See procedure given in the Package Outline  
Section  
2
1
MAXIMUM RATINGS  
POWERTAP II  
CASE 357C  
PLASTIC  
3
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
60  
V
RRM  
RWM  
V
R
MARKING DIAGRAM  
Average Rectified Forward Current  
I
A
A
F(AV)  
100  
200  
(Rated V , T = 140°C)  
Per Leg  
R
C
Per Device  
Peak Repetitive Forward Current,  
(Rated V , Square Wave,  
I
FRM  
MCC  
AYYWWG  
R
B20060T  
20 kHz, T = 140°C)  
Per Leg  
C
200  
NonRepetitive Peak Surge Current  
(Surge Applied at Rated Load Conditions  
Halfwave, Single Phase, 60 Hz)  
I
1500  
A
A
FSM  
B20060T = Specific Device Code  
MCC  
A
YY  
WW  
G
= Mold Compound Code  
= Assembly Location  
= Year  
Peak Repetitive Reverse Current  
(2.0 ms, 1.0 kHz)  
I
RRM  
Per Leg  
2.0  
Storage Temperature Range  
T
55 to +150  
55 to +150  
10,000  
°C  
°C  
= Work Week  
stg  
= PbFree Package  
Operating Junction Temperature  
T
J
Voltage Rate of Change (Rated V )  
dv/dt  
V/ms  
R
ORDERING INFORMATION  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
Device  
MBRP20060CT  
Package  
Shipping  
25 Units/Tray  
POWERTAP II  
MBRP20060CTG POWERTAP II 25 Units/Tray  
(PbFree)  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
September, 2006 Rev. 4  
MBRP20060CT/D  

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