MBR3045ST,
MBRB3045CT-1
SWITCHMODE™
Power Rectifier
Features and Benefits
• Dual Diode Construction — Terminals 1 and 3 May Be Connected
for Parallel Operation at Full Rating
• 45 V Blocking Voltage
http://onsemi.com
• Low Forward Voltage Drop
SCHOTTKY BARRIER
RECTIFIER
• 175°C Operating Junction Temperature
• Pb−Free Packages are Available
Applications
30 AMPERES
45 VOLTS
• Power Supply − Output Rectification
• Power Management
• Instrumentation
Mechanical Characteristics
3
2, 4
• Case: Epoxy, Molded
• Weight (Approximately): 1.9 Grams (TO−220AB)
1.5 Grams (TO−262)
1
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
MARKING
DIAGRAMS
• Lead Temperature for Soldering Purposes:
4
260°C Max. for 10 Seconds
• Epoxy Meets UL 94 V−0 @ 0.125 in
MAXIMUM RATINGS
TO−220AB
CASE 221A
STYLE 6
AYWW
B3045G
AKA
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
45
V
RRM
RWM
1
R
2
3
Average Rectified Current
(T = 130°C)
Per Device
Per Diode
I
30
15
A
A
A
F(AV)
4
C
Peak Repetitive Forward Current, per Diode
I
30
FRM
AYWW
B3045CTG
AKA
2
I PAK (TO−262)
CASE 418D
PLASTIC
(Square Wave, V = 45 V, 20 kHz)
R
Non−Repetitive Peak Surge Current (Surge
Applied at Rated Load Conditions,
Halfwave, Single Phase, 60 Hz)
I
150
FSM
Peak Repetitive Reverse Current, per Diode
(2.0 ms, 1.0 kHz)
I
2.0
A
°C
RRM
1
2
3
A
Y
= Assembly Location
= Year
Storage Temperature Range
T
−65 to
stg
WW
AKA
G
= Work Week
= Polarity Designator
= Pb−Free Device
+175
Operating Junction Temperature (Note 1)
T
J
−65 to
°C
+175
Peak Surge Junction Temperature
(Forward Current Applied)
T
J(pk)
175
°C
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Voltage Rate of Change (Rated V )
dv/dt
10,000
V/ms
R
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dP /dT < 1/R .
q
JA
D
J
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
January, 2011 − Rev. 8
MBR3045ST/D