MBR1100
Preferred Device
Axial Lead Rectifier
These rectifiers employ the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlap
contact. Ideally suited for use as rectifiers in low−voltage,
high−frequency inverters, free wheeling diodes, and polarity
protection diodes.
http://onsemi.com
SCHOTTKY
Features
• Low Reverse Current
BARRIER RECTIFIER
1.0 AMPERE, 100 VOLTS
• Low Stored Charge, Majority Carrier Conduction
• Low Power Loss/High Efficiency
• Highly Stable Oxide Passivated Junction
• Guard−Ring for Stress Protection
• Low Forward Voltage
• 175°C Operating Junction Temperature
• High Surge Capacity
• These are Pb−Free Devices*
DO−41
AXIAL LEAD
CASE 59
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
STYLE 1
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MARKING DIAGRAM
• Polarity: Cathode Indicated by Polarity Band
A
MBR1100
YYWW G
G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
100
V
RRM
RWM
R
A
Y
= Assembly Location
= Year
WW = Work Week
Average Rectified Forward Current
I
1.0
50
A
A
O
G
= Pb−Free Package
(V
≤ 0.2 V (dc), R
= 50°C/W,
q
JA
R(equiv)
R
(Note: Microdot may be in either location)
P.C. Board Mounting, [see Note 3], T = 120°C)
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
FSM
ORDERING INFORMATION
†
Device
Package
Shipping
Operating and Storage Junction Temperature
Range (Note 1)
T , T
−65 to
+175
°C
J
stg
MBR1100
Axial Lead*
Axial Lead*
1000 Units/Bag
1000 Units/Bag
MBR1100G
Voltage Rate of Change (Rated V )
dv/dt
10
V/ns
R
MBR1100RL
Axial Lead* 5000/Tape & Reel
Axial Lead* 5000/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MBR1100RLG
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dP /dT < 1/R .
q
JA
D
J
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
June, 2006 − Rev. 6
MBR1100/D