是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | QFP | 包装说明: | LFQFP, QFP176,1.0SQ,20 |
针数: | 176 | Reach Compliance Code: | compliant |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.77 |
具有ADC: | YES | 地址总线宽度: | |
位大小: | 32 | CPU系列: | FR60 |
最大时钟频率: | 10.2 MHz | DAC 通道: | NO |
DMA 通道: | YES | 外部数据总线宽度: | |
JESD-30 代码: | S-PQFP-G176 | JESD-609代码: | e6 |
长度: | 24 mm | I/O 线路数量: | 88 |
端子数量: | 176 | 最高工作温度: | 70 °C |
最低工作温度: | -10 °C | PWM 通道: | NO |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFQFP |
封装等效代码: | QFP176,1.0SQ,20 | 封装形状: | SQUARE |
封装形式: | FLATPACK, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 1.8,3.3 V | 认证状态: | Not Qualified |
RAM(字节): | 49152 | ROM(单词): | 1048576 |
ROM可编程性: | FLASH | 座面最大高度: | 1.7 mm |
速度: | 40.8 MHz | 子类别: | Microcontrollers |
最大压摆率: | 190 mA | 最大供电电压: | 3.6 V |
最小供电电压: | 3 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | TIN BISMUTH |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 24 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
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