生命周期: | Active | 包装说明: | , DIE OR CHIP |
Reach Compliance Code: | compliant | 风险等级: | 5.62 |
最高工作温度: | 85 °C | 最低工作温度: | -20 °C |
封装等效代码: | DIE OR CHIP | 电源: | 3/3.3 V |
认证状态: | Not Qualified | 子类别: | Other Telecom ICs |
电信集成电路类型: | TELECOM CIRCUIT | 温度等级: | OTHER |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MB89R118_06 | FUJITSU |
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ISO/IEC 15693 Compliant FRAM Embedded High-speed RFID LSI FerVID familyTM | |
MB89R118A-DI15 | FUJITSU |
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ISO/IEC 15693 Compliant FRAM Embedded High-speed RFID LSI FerVID family | |
MB89R118C | FUJITSU |
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ISO/IEC 15693 Compliant FRAM Embedded High-speed RFID LSI FerVID family | |
MB89R118C1-DI15 | FUJITSU |
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ISO/IEC 15693 Compliant FRAM Embedded High-speed RFID LSI FerVID family | |
MB89R118C1-DIAP15 | FUJITSU |
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Consumer Circuit, WAFER | |
MB89R118C2-DI15 | FUJITSU |
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ISO/IEC 15693 Compliant FRAM Embedded High-speed RFID LSI FerVID family | |
MB89R118C2-DIAB15 | FUJITSU |
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Consumer Circuit, WAFER | |
MB89R118C2-DIAP15 | FUJITSU |
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Consumer Circuit, WAFER | |
MB89R119 | FUJITSU |
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ISO/IEC 15693 Compliant FRAM Embedded High-speed RFID LSI FerVID family | |
MB89R119B1-DIAP15 | FUJITSU |
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Memory Circuit, 256X8, CMOS, WAFER |